EP53TC

Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding, sealing, coating, and potting
Key Features
  • Applicable in very thin bond lines
  • Low thermal resistance
  • High thermal conductivity >2.0 W/(m•K)
  • Flowable
Typical Properties
Viscosity
45,000-65,000 cps
Cure Schedule
Cures at 80°C for 2 hours followed by 2-4 hours at 90-125°C.
Hardness
85-95 Shore D
Service Temperature Range
-100°F to +300°F
Acoustical Impedance
8.5 MRayl
Thermal Conductivity
16-18 BTU•in/(ft²•hr•°F) [2.31-2.60 W/(m•K)]
Imagen
EP53TC Two Part Epoxy
Certifications

ASTM E595 Compliant

Meets EU Directive 2015/863

Packaging
Product Description

Master Bond EP53TC is a thermally conductive, electrically insulating two part epoxy that combines good physical properties and the ability to transfer heat rapidly and effectively. EP53TC has a forgiving 100 to 5 mix ratio by weight. The working life ranges from 6-8 hours. This epoxy cures at 80°C for 2 hours followed by 2-4 hours at 90-125°C. An alternative cure schedule would be 4-6 hours at 80-90°C. The hallmark of this system is good thermal conductivity, reliable electrical insulation, and the ability to be used for encapsulation applications.

A special feature of this material is its small particle fillers ranging in size from 5 to 30 microns. When bonding, this allows the epoxy to be applied in especially thin sections resulting in very low thermal resistance. Thermally conductive epoxy usually has a thermal resistance ranging from 30-45 x 10-6 K•m2/W. With EP53TC the thermal resistance is significantly lower because of the high conductivity filler and its ultra small particle size (10-15 x 10-6 K•m2/W). The end result is the epoxy is very effective in transferring heat. The lower the thermal resistance, the better it is for heat transfer properties.

The system bonds well to a wide variety of substrates, including metals, composites, glass, ceramics and many plastics. Other attributes include a very low coefficient of thermal expansion, low shrinkage upon curing and exceptional dimensional stability. It resists water, fuels, oils and many acids and bases. The temperature range is -100°F to +300°F. The color of Part A is gray and Part B is amber clear. This special system can be used in the aerospace, electronic, optical, and specialty OEM industries, for bonding and small potting applications where lower thermal resistance results in better heat transferring properties.

Product Advantages

  • Long working life and good flow
  • Good thermal conductivity and electrical insulation
  • Low coefficient of thermal expansion
  • Low thermal resistance
  • Excellent for potting and encapsulation
  • Passes ASTM E595 for NASA low outgassing specifications
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