EP79FL

Master Bond EP79FL is a two component, electrically conductive epoxy for high performance bonding, coating and sealing. It utilizes silver coated nickel as the conductive filler and can be considered a cost effective alternative to more standard silver conductive epoxies. Most significantly, the epoxy is very flexible upon curing, which enables it to be used in applications involving rigorous thermal cycling and aggressive mechanical and thermal shocks. Additionally, it has a high T-peel strength. EP79FL has a convenient one to one mix ratio by weight, and it cures readily at room temperature or more rapidly at higher temperatures. To optimize its properties, the recommended cure schedule is overnight at room temperature followed by a heat cure of 2-3 hours at 200°F. It is 100% reactive and does not contain any solvents or diluents, and has low shrinkage upon cure. Its electrical resistance is very low—less than 0.005 ohm-cm and its thermal conductivity is quite good. EP79FL can be applied readily with brush and has good flow properties. The system is conducive to thermal cycling over the exceptionally wide temperature range of 4K to +275°F, enabling it to be serviceable even in cryogenic applications. It has good chemical resistance to water, oils and fuels. Adhesion to metals, composites, glass, ceramics, vulcanized rubbers and many plastics is excellent. Parts A and B are both colored gray. Master Bond EP79FL adhesive is widely used in the electronic, aerospace, computer, semiconductor and electro-optic industries, among others.

Product Advantages

• Convenient mixing: one to one ratio by weight
• Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly
• Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required
• Very low volume resistivity(<0.005 ohm-cm)
• Cost effective alternative to silver filled epoxy