EP3HTSDA-2Med

Master Bond EP3HTSDA-2Med is a fast curing, one part silver filled epoxy with exceptional electrical and thermal conductivity. It is not premixed and frozen and does not require storage in a freezer. Curing occurs only when heated to 250-300°F. Since it will not cure until heated, its working life is unlimited at room temperature. EP3HTSDA-2Med has a smooth consistency and dispenses easily.

It bonds well to a wide variety of substrates including metals, ceramics, plastics, silicon dies, among others. Although it is a filled system, it still has robust physical strength properties including lap shear strength. Its most prominent features are its low volume resistivity and high thermal conductivity. The filler particles used in this epoxy are exceptionally small (average 2-3 microns, largest less than 20), allowing for ultra thin bond lines and its very low thermal resistance 2-3 x 10^-6 K•m²/W.

The temperature range is -80°F to +450°F. It has good resistance to liquid sterilants such as glutaraldehyde, as well as EtO, gamma radiation and similar type sterilants. EP3HTSDA-2Med is easy to use, with very high thermal and electrical conductivity, while meeting the medical grade criteria mentioned previously. It should be considered in applications with medical devices, where heat curing at 250-300°F is possible and the product profile outlined here is desirable.

Product Advantages

• Single component system, no mixing
• Not premixed and frozen
• Highly electrically conductive
• Impressive thermal conductivity
• Convenient packaging