Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP29LPAOHT Two component, thermally conductive, electrically insulative epoxy system Coefficient of Thermal Expansion 22-24 x 10⁻⁶ in/in/°C Volume Resistivity >10¹⁵ ohm-cm	NASA Low Outgassing RoHS Compliant	Potting Coating Bonding Casting Encapsulation Sealing Gap Filling	10,000-30,000 cps	overnight at 75°F followed by 4-6 hours at 150°F to 170°F	80-90 Shore D	-60°F to +350°F	/fr/tds/ep29lpaoht
EP29LPHE Two part, very low viscosity epoxy for bonding, sealing, coating and potting Dielectric Strength 450 volts/mil Elongation 100-150%	RoHS Compliant	Bonding Sealing Coating Encapsulation	350-700 cps	12-24 hours at 75°F, followed by 4-5 hours at 140-180°F	50-60 Shore D	-60°F to +250°F	/tds/ep29lphe
EP29LPHT Two part, low viscosity epoxy for bonding, sealing, potting and filament winding featuring higher temperature resistance Tensile Lap Shear Strength 2,400-2,600 psi Volume Resistivity >10¹⁵ ohm-cm	RoHS Compliant	Bonding Sealing Potting Gap Filling Encapsulation	500-2,000 cps	overnight at 75°F followed by 6 to 8 hours at 140-165°F. If possible, post curing for an additional 4 to 6 hours at 150-200°F will enhance the product's properties.	80-90 Shore D	-80°F to +350°F	/fr/tds/ep29lpht
EP29LPSPAO Two component, low viscosity epoxy for bonding, sealing, coating, potting and encapsulation Tensile Lap Shear Strength >1,000 psi Tensile Modulus >450,000 psi	RoHS Compliant MIL-STD-810G for Fungus Resistance	Bonding Coating Sealing Potting Encapsulation Casting	4,000-15,000 cps	gelling the mixed epoxy at 75°F, followed by alternative lower elevated temperature cure cycles (8-10 hours at 130-150°F) or (5-7 hours at 175°F) or (3-5 hours at 200°F)	>75 Shore D	4K to +275°F	/fr/tds/ep29lpspao
EP29LPSPAO-1 BLACK Two component, thermally conductive, electrically insulative, cryogenically serviceable epoxy Coefficient of Thermal Expansion 22-25 X 10⁻⁶ in/in/°C Volume Resistivity >10¹⁵ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Gap Filling Casting Underfill	4,000-15,000 cps	Gel at room temp followed by any option listed below: 130-150°F for 8-10 hours, 175°F for 5-7 hours, 200°F for 3-5 hours	80-85 Shore D	4K to +250°F	/fr/tds/ep29lpspao-1-black
EP29LPSPND-3 Two component epoxy compound for cryogenic applications Dielectric Constant 4.2 Refractive Index 1.56	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	Gel at 75°F for 12-24 hours followed by either option listed below: 130-150°F for 12-18 hours or 150-165°F for 5-10 hours.	70-80 Shore D	4K to 250°F	/fr/tds/ep29lpspnd-3
EP29LPTCHT Two component, thermally conductive, electrically insulative epoxy system Coefficient of Thermal Expansion 22-24 x 10⁻⁶ in/in/°C Dielectric Constant 4.4	NASA Low Outgassing RoHS Compliant	Bonding Sealing Encapsulation Potting Underfill Casting Gap Filling	5,000-15,000 cps	overnight at 75°F followed by 4-5 hours at 160°-180°F	80-90 Shore D	-60°F to +350°F	/fr/tds/ep29lptcht
EP30 Highly versatile, two part epoxy system for bonding, coating, sealing and casting Dielectric Strength 440 volts/mil Refractive Index 1.57	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Encapsulation Potting	Part A: 400-900 cps, Part B: 280-500 cps	can be cured at 75°F in 24-48 hours or faster cures can be realized at elevated temperatures, e.g., 2-3 hours at 200°F	80-90 Shore D	-60°F to +250°F	/fr/tds/ep30
EP30-2LB Two component, room temperature curing, optically clear epoxy for bonding, sealing, coating and encapsulation. Formulated to have special optical properties Refractive Index 1.55 Volume Resistivity >10¹⁵ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Coating Potting Sealing Encapsulation Gap Filling	Part A: 10,000-16,000 cps, Part B: 10-35 cps	24-48 hours at 75°F or 2-3 hours at 150-200°F	80-90 Shore D	-80°F to +300°F	/fr/tds/ep30-2lb
EP30-3 Highly versatile, two part epoxy system for bonding, coating, sealing and casting Glass Transition Temperature (Tg) >325°F Volume Resistivity >10¹⁵ ohm-cm	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	2,000-5,000 cps	60-120 minutes at 170°F plus 2-3 hours at 300°F	>75 Shore D	-80°F to +450°F	/fr/tds/ep30-3

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