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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP42-2LV Black Two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance Dielectric Constant 4.0 Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Casting Potting Gap Filling Encapsulation	1,000-2,000 cps	75°F: 48-72 hours, 200°F: 2-3 hours, Optimum cure schedule: overnight at 75°F plus 2-4 hours at 150-200°F	80-90 Shore D	-60°F to +350°F	/fr/tds/ep42-2lv-black
EP42HT-2 Two component, room temperature curing epoxy compound Dielectric Constant 3.8 Refractive Index 1.63	RoHS Compliant	Bonding Casting Coating Encapsulation Gap Filling Potting Sealing	Part A: 55,000-110,000 cps, Part B: 30-70 cps	75°F: 48-72 hours; 200°F: 2-3 hours	>75 Shore D	-60°F to +450°F	/fr/tds/ep42ht-2
EP42HT-2AO-1 Black Two part, room temperature curable epoxy adhesive, sealant, coating and casting system Coefficient of Thermal Expansion 18-21 x 10⁻⁶ in/in/°C Tensile Lap Shear Strength 900-1,100 psi	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Casting Encapsulation Potting	Part A: 50,000-120,000 cps, Part B: 200-1,000 cps	75°F: 3-5 days; 200°F: 2-3 hours	85-90 Shore D	4K to +400°F	/fr/tds/ep42ht-2ao-1-black
EP42HT-2FG Two component epoxy system formulated for food applications Tensile Modulus >450,000 psi Volume Resistivity >10¹⁴ ohm-cm	FDA Food Grade 21 CFR 175.105 FDA Food Grade 21 CFR 175.300 RoHS Compliant USP Class VI Medical ISO 10993-5 for Cytotoxicity	Bonding Sealing Coating Casting Potting Gap Filling Encapsulation	Part A: 55,000-110,000 cps, Part B: 30-70 cps	150°-250°F for 3-4 hours; optimum cure schedule is overnight at 75°F followed by 3-4 hours at 150-250°F.	>75 Shore D	-60°F to +450°F	/fr/tds/ep42ht-2fg
EP42HT-2FG Black Two component, high temperature resistant epoxy for indirect food applications Dielectric Constant 4.6 Glass Transition Temperature (Tg) 145-150°C	FDA Food Grade 21 CFR 175.105 RoHS Compliant	Bonding Sealing Coating Encapsulation Potting Gap Filling Casting	Part A: 55,000-110,000 cps, Part B: 30-80 cps	overnight at 75°F followed by a post cure of 3-4 hours at 150-250°F	80-90 Shore D	-60°F to +450°F	/fr/tds/ep42ht-2fg-black
EP42HT-2LTE Two component, room temperature curing epoxy compound featuring an ultra low coefficient of thermal expansion Coefficient of Thermal Expansion 9-12 X 10⁻⁶ in/in/°C Dielectric Constant 4.4	1,000 Hours at 85°C/85% RH NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	paste	cures within 4-7 days at 75°F; faster cures can be realized at elevated temperatures, e.g. hours at 150-200°F; desirable cure schedule is overnight at 75°F followed by 3-5 hours at 150-200°F	85-95 Shore D	4K to +300°F	/fr/tds/ep42ht-2lte
EP42HT-2Med Black Two component, high temperature resistant epoxy for medical device assembly Dielectric Constant 4.0 at 75°F, 60Hz Glass Transition Temperature (Tg) 150-155°C	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing Coating Potting Casting Encapsulation Gap Filling	Part A: 55,000-110,000 cps, Part B: 30-70 cps	48-72 hours at 75°F; 2-3 hours at 200°F	75-85 Shore D	-60°F to +450°F	/fr/tds/ep42ht-2med-black
EP42HT-2ND-2 Two component, room temperature curing epoxy compound featuring high temperature resistance Dielectric Constant 4.4 Glass Transition Temperature (Tg) 150-155°C	RoHS Compliant	Bonding Sealing Coating Gap Filling	Paste	8-12 hours at 75°F followed by 2-4 hours at 175-250°F	80-90 Shore D	-60°F to 450°F	/fr/tds/ep42ht-2nd-2
EP42HT-2ND-2Med Black Two component, high temperature resistant epoxy compound for medical device assembly Dielectric Constant 4.0 Glass Transition Temperature (Tg) 150-155°C	ISO 10993-5 for Cytotoxicity USP Class VI Medical RoHS Compliant	Bonding Sealing Gap Filling Coating	Part A: >1,000,000 cps, Part B: >250,000 cps	overnight at 75°F followed by 6-8 hours at 135-165°F or 4-6 hours at 175-185°F	75-85 Shore D	-60°F to +450°F	/fr/tds/ep42ht-2nd-2med-black
EP42HT-3AO Two part, room temperature curable epoxy adhesive, sealant, coating and encapsulating system Acoustical Impedance 5.3 MRayl Glass Transition Temperature (Tg) 140-150°C	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Encapsulation Gap Filling Potting	40,000-80,000 cps	Cure in 3-4 days at 75°F or 2-3 hours at 150-200°F; Recommended curing is overnight at 75°F followed by 2-3 hours at 150-200°F; Optimum cure schedule: Overnight at 75°F, followed by 2-3 hours at 150-200°F	85-95 Shore D	4K to +400°F	/fr/tds/ep42ht-3ao

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