Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
UV18Med High strength, toughened UV curable system for bonding in medical applications Dielectric Constant 3.6 Refractive Index 1.524	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing	1,200-4,800 cps	Cures readily in 20-30 seconds when exposed to a UV light source emitting at a wavelength of 320-365 nm, with an energy output as low as 20-40 milliwatts per cm²	50-60 Shore D	-60°F to 250°F	/fr/tds/uv18med
UV18Med-2 High strength, toughened UV curable system for medical grade applications Dielectric Constant 3.6 at 75°F, 60Hz Volume Resistivity >10¹⁴ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Gap Filling	1,200-4,800 cps	20-30 seconds when exposed to a UV light source emitting at a wavelength of 320-365 nm, with an energy output as low as 20-40 milliwatts per cm²	50-60 Shore D	-60°F to +250°F	/fr/tds/uv18med-2
UV19 Ultra low viscosity, very flexible, UV curing system for bonding, sealing, coating, and encapsulation Dielectric Constant 3.9 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	80-300 cps	Cures readily in 10-30 seconds when exposed to a UV light source emitting at a wavelength of 320-365 nm with an energy output as low as 20-40 milliwatts/cm2	40-50 Shore A	-80°F to +250°F	/fr/tds/uv19
UV21 UV system for high performance bonding, sealing, coating, encapsulation and formed-in-place gaskets Elongation >250% Refractive Index 1.49	RoHS Compliant	Bonding Sealing Coating Encapsulation Gasketing	30,000-80,000 cps	cures readily in 10-30 seconds when exposed to a UV light source emitting at a wavelength of 320-365 nm with an energy output as low as 20-40 milliwatts/cm2	40-60 Shore A	-65°F to +250°F	/fr/tds/uv21
UV22 One component, optically clear, nanosilica filled UV curable epoxy system; meets NASA low outgassing specification Coefficient of Thermal Expansion 30-35 ppm/°C Refractive Index 1.52	1,000 Hours at 85°C/85% RH RoHS Compliant ASTM D4060-14 for Abrasion Resistance NASA Low Outgassing	Bonding Sealing Coating Encapsulation	2,000-6,000 cps	UV light 320-365 nm for 15-45 seconds	75-85 Shore D	-80°F to +350°F	/fr/tds/uv22
UV22DC80-10F One component, nanosilica filled, dual cure system with UV and heat curing mechanisms Glass Transition Temperature (Tg) 130-135°C Refractive Index 1.52	NASA Low Outgassing RoHS Compliant	Bonding Coating Encapsulation Sealing	5,000-15,000 cps	Cures at 80°C in shadowed out areas; typically the UV portion occurs in 10-30 seconds at 365 nm with 10-40 milliwatts/cm2 of output; areas not cured because of shadowing effects can be readily cured at 80°C for 30-60 minutes; post curing at 125-150°C for 15-30 minutes will increase the To significantly.	75-85 Shore D	-100°F to +350°F	/fr/tds/uv22dc80-10f
UV22DC80-1Med One component, nanosilica filled, dual cure system with UV and heat curing mechanisms passes ISO 10993-5 for cytotoxicity and USP Class VI Dielectric Constant 3.85 Glass Transition Temperature (Tg) 120-130°C	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Coating Sealing Gap Filling Underfill Encapsulation Potting	500-3,500 cps	UV light 320-365 nm for 20-30 seconds, followed by 80°C for 1 hour	80-90 Shore D	-60°F to +350°F	/fr/tds/uv22dc80-1med
UV22DC80ND One component, nanosilica filled, dual cure system with UV and heat curing mechanisms Coefficient of Thermal Expansion 30-35 X 10⁻⁶ in/in/°C Glass Transition Temperature (Tg) 130-135°C	NASA Low Outgassing RoHS Compliant	Bonding Coating Gap Filling Sealing	paste	10-30 seconds at 365 nm with 10-40 milliwatts/cm2 of output; areas not cured can be cured at 80°C for 30-60 minutes; post curing at 125-150°C for 15-30 minutes	75-85 Shore D	-60°F to +350°F	/fr/tds/uv22dc80nd
UV22DC80TK One component, nanosilica filled, dual cure system with UV and heat curing mechanisms Coefficient of Thermal Expansion 30-35 x 10⁻⁶ in/in/°C Refractive Index 1.52	NASA Low Outgassing RoHS Compliant	Bonding Coating Gap Filling Sealing Encapsulation	40,000-80,000 cps	Typically the UV portion occurs in 10-30 seconds at 365 nm with 10-40 milliwatts/cm2 of output. Areas not cured because of shadowing effects can be readily cured at 80°C for 30-60 minutes. Post curing at 125-150°C for 15-30 minutes will increase the Ta significantly.	75-85 Shore D	-60°F to +350°F	/fr/tds/uv22dc80tk
UV23FLDC-80 One component, dual curing (UV light and heat) that cures with good flexibility Dielectric Constant 4.7 Elongation 90-100%	RoHS Compliant	Bonding	100-400 cps	20-30 seconds when exposed to a UV light source emitting at a wavelength of 320-365 nm with an energy output as low as 20-40 milliwatts per cm²; secondary curing in shadowed out areas by heating, typically 60-90 minutes at 80-85°C	45-55 Shore D	-80°F to +300°F	/fr/tds/uv23fldc-80

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