Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP17TF One component, toughened epoxy system for bonding, sealing and coating Elongation 5-10% Tensile Lap Shear Strength 8,000-9,000 psi	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	paste	5-6 hours at 300°F followed by a post cure of 4-5 hours at 350°F	85-95 Shore D	-150°F to +550°F	/fr/tds/ep17tf
EP19HT One component epoxy system for impregnation, lamination, sealing and coating Dielectric Constant 3.6 Glass Transition Temperature (Tg) 120-125°C	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Impregnation	300-700 cps	1 hour at 250°F followed by a post cure of 1-2 hours at 300-350°F.	80-90 Shore D	-60°F to +400°F	/fr/tds/ep19ht
EP19HTFL One component epoxy system for impregnation, lamination, sealing and coating Glass Transition Temperature (Tg) 125-130°C Tensile Modulus >300,000 psi	RoHS Compliant	Sealing Coating Impregnation	300-700 cps	1 hour at 250°F followed by a post cure of 1-2 hours at 300-350°F	>65 Shore D	-60°F to +350°F	/fr/tds/ep19htfl
EP19HTLV One component epoxy system for impregnation, lamination, sealing and coating Dielectric Constant 3.6 Volume Resistivity >10¹⁵ ohm-cm	RoHS Compliant	Bonding Sealing Coating Impregnation	300-800 cps	Optimum curing schedule is 1 hour at 250°F followed by a post cure of 1-2 hours at 300-350°F.	>65 Shore D	-60°F to +400°F	/fr/tds/ep19htlv
EP19HTLV-2 One component epoxy system for impregnation, lamination, sealing and coating Dielectric Constant 3.6 Glass Transition Temperature (Tg) 125-130°C	RoHS Compliant	Bonding Sealing Coating Impregnation	200-700 cps	Curing schedule options include 250°F for 60-90 minutes or 300°F for 45-60 minutes.	>65 Shore D	-60°F to +400°F	/fr/tds/ep19htlv-2
EP21 Two component, room temperature curing epoxy compound Dielectric Constant 2.9 Tensile Lap Shear Strength 2,800-3,000 psi	RoHS Compliant	Bonding Sealing Coating Encapsulation	Part A: 28,000-42,000 cps, Part B: 45,000-65,000 cps	75°F: 48-72 hours; 200°F: 2-3 hours; Optimum cure schedule: overnight at 75°F, plus 2-3 hours at 150-200°F	70-80 Shore D	-60°F to +250°F	/fr/tds/ep21
EP21AC Two component epoxy system for encapsulating and coating that passes UL746A high amp arc ignition at 3.0 mm thickness with a PLC of 0 Dielectric Constant 4.7 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant UL 94HB for Flame Retardancy UL 746A for High Amp Arc Ignition Resistance	Bonding Sealing Coating Casting Encapsulation Potting	30,000-50,000 cps	75°F: 48-72 hours; 150-175°F: 2-3 hours; Optimal cure: Overnight at 75°F followed by 4-6 hours at 135-165°F	75-85 Shore D	-75°F to +194°F	/fr/tds/ep21ac
EP21AOLV Two component epoxy compound for bonding, sealing, coating and potting Dielectric Constant 4.7 Tensile Lap Shear Strength 1,400-1,600 psi	RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Gap Filling	Part A: 40,000-60,000 cps, Part B: 50,000-70,000 cps	overnight at 75°F followed by 3-5 hours at 150-200°F	85-95 Shore D	-60°F to +250°F	/fr/tds/ep21aolv
EP21AOLV-1 Two component epoxy compound for bonding, sealing, coating and encapsulating Coefficient of Thermal Expansion 22-25 X 10⁻⁶ in/in/°C Dielectric Strength 450 volts/mil	RoHS Compliant	Bonding Sealing Coating Gap Filling Casting Potting	Part A: 4,000-8,000 cps, Part B: 50,000-65,000 cps	overnight at 75°F followed by 3-5 hours at 150-200°F	85-95 Shore D	-60°F to +250°F	/fr/tds/ep21aolv-1
EP21AOLV-2LO Two component epoxy compound for bonding, sealing, coating and encapsulating Coefficient of Thermal Expansion 22-25 X 10⁻⁶ in/in/°C Dielectric Strength 400-450 volts/mil	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH MIL-STD-810G for Fungus Resistance	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 1,500-3,000 cps, Part B: 55,000-125,000 cps	75°F: 3-4 days; 200°F: 2-3 hours; Optimum cure schedule: overnight at 75°F followed by 3-4 hours at 150-200°F	75-85 Shore D	-60°F to +250°F	/fr/tds/ep21aolv-2lo

Need Expert Guidance?

Our expert engineers offer one-on-one consultations to help you navigate our extensive material library and find the right solution for your application. We ensure confidentiality and quick turnaround (1-2 business days).

Discuss Your Application