News Releases

Stay informed about Master Bond's latest product developments, industry news, company events, and other exciting announcements.

	Low to Moderate Viscosity, Toughened Two Component Epoxy System for High Performance Casting, Bonding and Sealing Release Date: 02/25/2010 Product: EP21FL Master Bond EP21FL is a two part epoxy resin system that features low to moderate viscosity. It is well suited for potting, coating and sealing electronic assemblies and excels at bonding dissimilar substrates with different coefficients of expansion. This high performance adhesive has a wide service temperature range of -60ºF to… Read More...
	USP Class VI Approved Silicone Compound for Potting & Encapsulation Release Date: 11/24/2009 Product: MasterSil 151Med Flexibility is of vital importance in the design of medical devices subjected to vibration, impact, shock and thermal cycling. Two component, room temperature curing Master Bond MasterSil 151Med is a medical grade, potting and encapsulation silicone formulated to withstand such exposures. With a low viscosity of 1,500 cps, it is… Read More...
	UV Curable Compound With Superior Gap Filling Properties Release Date: 10/29/2009 Product: UV10TK40 Master Bond UV10TK40 is a UV curable, no-mix epoxy resin system with exceptional sealing and gap-filling properties. It excels in applications such as aligning parts and bonding irregularly shaped surfaces, especially in production environments where increased speed and reduced waste are paramount. Its very high surface… Read More...
	Epoxy For High Temperature Service Up To 600°F Release Date: 10/08/2009 Product: EP46HT-1 Developed after years of research, Master Bond EP46HT-1 extends the limits of epoxy adhesive/sealant formulations. It has a continuous service operating temperature range of -100°F to +600°F and can withstand intermittent exposures up to +600°F. EP46HT-1 has a glass transition temperature of over 240°C. In addition to high… Read More...
	New Low Viscosity Adhesive/Sealant Cures at Room Temperature Release Date: 09/18/2009 Product: EP30 Master Bond Inc., Hackensack, NJ has developed a new, easy to use, two component epoxy adhesive for high performance bonding applications called EP30. It develops outstanding physical strength properties even when cured at ambient temperatures. Cure can be accelerated by use of moderate heat. EP30 features very low viscosity… Read More...