News Releases

Stay informed about Master Bond's latest product developments, industry news, company events, and other exciting announcements.

	Epoxy Cures at Low Temperature Release Date: 07/26/2007 Product: EP27 Achievement of high performance cures at low temperatures has long been a problem for epoxy resin compositions. Master Bond Inc. has successfully overcome this problem with a newly developed epoxy resin system called Master Bond EP27. In 6 mil thick films, EP27 will set in as little as 2 hours at only 40°F and will cure in 48-… Read More...
	Master Bond Introduces Flexible Epoxy Resin Compound EP40 with Unexcelled Shear/Peel Strength for High Performance Bonding, Sealing and Casting to Engineering Plastics Particularly Polycarbonates and Acrylics As Well As To Metals Release Date: 04/03/2007 Product: EP40 Master Bond has successfully developed a new, highly flexible two component epoxy resin compound called EP40 which features outstanding shear and peel strength and is especially designed for bonding, sealing and casting engineering plastics and metals. This compound has been formulated to cure readily at ambient or more quickly… Read More...
	Adhesive resists up to 400°F Release Date: 01/05/2007 Product: EP21HT Master Bond Inc., Hackensack, N.J. is proud to announce the development of a new two component, room temperature curing epoxy adhesive called EP21HT. This system is easy to use and has a convenient, forgiving 1 to 1 mix ratio by weight or volume. EP21HT is 100% reactive and contains no solvents or volatiles. It has excellent… Read More...
	Flexible, Low Outgassing Epoxy Resin Compound Has High Thermal Conductivity Release Date: 01/01/2007 Product: EP21TDC-2LO Master Bond Inc., Hackensack, N.J. has introduced a new high performance bonding, sealing, coating and encapsulation system called EP21TDC-2LO. This formulation offers high flexibility and excellent toughness. It cures at room temperatures or more rapidly at elevated temperatures. It has a 1 to 3 mix ratio by weight or volume and… Read More...
	Low Viscosity Epoxy Features Excellent Adhesion to Glass, Polycarbonates & Acrylics Release Date: 12/07/2006 Product: EP30P Master Bond Inc has introduced EP30P, a new two component, transparent, low viscosity epoxy system for high performance bonding, sealing, coating, encapsulation and casting. This system has a 4 to 1 mix ratio by weight and is formulated to cure at room temperatures. Cures can be accelerated by the use of heat. EP30P bonds well to… Read More...