Supreme 18TC

Master Bond Supreme 18TC is a cutting edge material pertaining to the thermal management of epoxies. This system utilizes a special blend of highly thermally conductive filler material that is capable of being applied in bond lines as thin as 10-15 microns. Supreme 18TC maintains high bond strength properties even when exposed to hostile environmental conditions, including elevated temperatures.

Supreme 18TC has very low thermal resistance, since it is highly thermally conductive and able to cure effectively in thin layers. Another way of looking at this is to say that the lower the thermal resistance, the better the heat transfer. In this regard, Master Bond utilizes the principles based on the formula: R=t/K (where “R” is the thermal resistance; “t”, the thickness and “K” the thermal conductivity of the material). Using specific values, when standard alumina filled thermally conductive epoxy is applied in 50 micron thick sections, the thermal resistance is 30-35 x 10^-6 K•m²/W. With Supreme 18TC, the thermal resistance is significantly lower: 8-12 x 10^-6 K•m²/W, because of the filler and its ability to be effectively applied in sections of 10-15 microns in width. Simply put, this epoxy is second to none when transferring heat.

Significantly, Supreme 18TC is a one part system that requires no mixing. Its working life is essentially unlimited as it is not premixed and frozen. It is has a smooth paste consistency that requires heat curing for 60-90 minutes at 250-300°F with a post cure of a few hours to obtain optimal properties. Some other positives include low shrinkage upon curing, a low CTE and a high degree of dimensional stability. It bonds well to a wide variety of substrates including metals, composites, ceramics and plastics. Supreme 18TC is designed to withstand thermal cycling and shock. Electrically, it is an outstanding insulator. The operating temperature is 4K to +400°F and the color is gray. The forte of Supreme 18TC is high heat transfer and its simple handling, which allows it to be a prime candidate for sophisticated, high-tech applications. Some of the industries where this can be used include aerospace, electronic, optical, specialty OEM and cryogenic industries.

Product Advantages

• One part system; no mixing required
• Cures readily at 250-300°F with a post cure at 350°F
• High thermal conductivity and electrical insulation values
• Will cure effectively in very thin sections
• Superior thermal cycling capabilities
• Exceptionally low thermal resistance
• Meets NASA low outgassing specifications