EP17HTDA-1

Master Bond EP17HTDA-1 is a one component, heat cured epoxy system primarily for die attach applications as well as more conventional bonding and sealing. It requires no mixing and cures readily at 300-350°F. It is not premixed and frozen and has an unlimited working life at room temperature. This epoxy will tack reasonably fast, 12-15 minutes at 212°F, 5-6 minutes at 300°F. This is followed by curing at either 2-3 hours at 300°F or 1-2 hours at 350°F, in order to optimize properties. EP17HTDA-1 has excellent consistency and flow for die attach applications.

This epoxy system features excellent physical properties, superb electrical insulation along with good thermal conductivity, even at elevated temperatures. This system is also distinctive in that it has a relatively low exotherm upon curing. EP17HTDA-1 is 100% reactive and contains no solvents or diluents. EP17HTDA-1 bonds well to similar and dissimilar substrates such as metal, ceramics, plastics and composites. It has a noteworthy resistance to many chemicals including acids, bases, salts, fuels, oils and many solvents. Significantly, it has minimal shrinkage upon curing. Its service temperature range is from -80°F to +525°F. Since it passes NASA low outgassing, it can be used in vacuum type situations and other applications where that requirement is needed. EP17HTDA-1 is used primarily as a die attach and adhesive/sealant in electronic and related applications, where high temperature resistance, good electrical insulation properties and thermal conductivity are desirable.

Product Advantages

• Single component system
• Thermally conductive, electrically insulative
• Excellent die shear strength
• High temperature resistance
• Ideal viscosity flow profile for die attaching
• Fast tacking