EP40TCMed

Master Bond EP40TCMed is a two component, thermally conductive, electrically isolating epoxy for bonding and sealing. It combines convenient processing with superior strength properties after curing. It is a moderate viscosity, flowable system with a forgiving 1 to 1 mix ratio by weight or volume, and a user friendly working life. EP40TCMed cures readily at ambient temperatures or more rapidly with heat. The optimum cure schedule is overnight at room temperature followed by 3-5 hours at 125°F to 150°F. The system has no solvents or diluents and offers low shrinkage upon curing.

This epoxy bonds well to a wide range of substrates including metals, ceramics, composites and many plastics. Most compelling is its exceptionally high shear and peel strength. EP40TCMed has remarkable toughness as indicated by its high elongaton of 60-70%. This translates into the ability to withstand the most rigorous thermal cycling as well as vibration and shock. It is able to transfer heat, without conducting electricity. The ability to transfer heat is enhanced by the exceptionally small particle size of the filler used in this system. The average particle size is 3-4 microns, the largest is 14 microns(<1%). The net effect is to allow for thinner bond lines and lower thermal resistance values. This system resists many chemicals including water, oils, fuels and most notably, EtO, radiation and several cold sterilants. The color of Part A is light gray and Part B is gray. The service temperature range is -100°F to +300°F. EP40TCMed should be considered in medical device assembly applications where a thermally conductive, electrically insulating, biocompatible epoxy is needed.

Product Advantages

• Easy processing, 1:1 mix ratio
• Long open time
• Outstanding shear and peel strength
• Very high elongation
• Resists sterilization