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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP42HT-2LO Two component epoxy adhesive, sealant, coating and casting system Dielectric Constant 3.8 Volume Resistivity >10¹⁴ ohm-cm	1,000 Hours at 85°C/85% RH NASA Low Outgassing RoHS Compliant	Bonding Casting Coating Encapsulation Gap Filling Sealing	Part A: 55,000-110,000 cps, Part B: 30 - 70 cps	75°F for 48-72 hours, 200°F for 2-3 hours	80-90 Shore D	-60°F to +450°F	/it/tds/ep42ht-2lo
EP42HT-2Med Two component, high temperature resistant epoxy for medical device assembly Acoustical Impedance 3.1 MRayl Glass Transition Temperature (Tg) 150-155°C	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Casting Coating Encapsulation Gap Filling Potting Sealing	Part A: 55,000-110,000 cps, Part B: 30 - 70 CPS	overnight at 75°F followed by 2-4 hours at 150-250°F	75-85 Shore D	-60°F to 450°F	/it/tds/ep42ht-2med
EP4EN-80 One component flowable epoxy for bonding and small encapsulation applications with a curing schedule at 80°C to 85°C Dielectric Constant 4.4 Thermal Conductivity 5.2-5.9 BTU•in/(ft²•hr•°F) [0.75-0.85 W/(m•K)]	NASA Low Outgassing RoHS Compliant	Bonding Encapsulation Potting	600-1,800 cps	90 minutes at 65°C plus 30 minutes at 80-85°C	85-95 Shore D	-58°F to +302°F	/it/tds/ep4en-80
EP5G-80 One component, graphite filled epoxy with a curing temperature of 80°C Glass Transition Temperature (Tg) 130-140°C Volume Resistivity 5-15 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Coating Sealing	30,000-300,000 cps	4 hours at 80°C	75-85 Shore D	-58°F to +347°F	/it/tds/ep5g-80
EP5TC-80 One component thermally conductive, electrically insulating epoxy with a curing temperature of 80°C Dielectric Constant 4.6 Volume Resistivity >10¹² ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Coating Sealing	60,000-180,000 cps	80°C for 90-120 minutes with an optional post cure of 1-2 hours at 80°C to optimize properties	90-100 Shore D	-58°F to +302°F	/it/tds/ep5tc-80
EP62-1ND Two component epoxy resin system featuring excellent temperature and chemical resistance, non-drip application Tensile Lap Shear Strength 8,000-9,000 psi Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Coating Gap Filling Sealing	paste	4-6 hours at 140-158°F [60-70°C], 20-40 minutes at 176-212°F [80-100°C] or 10-20 minutes at 257°F [125°C]	75-85 Shore D	-60°F to +450°F	/it/tds/ep62-1nd
EP65HT-1 Two component epoxy system featuring the special combination of very fast setup times and high temperature resistance Dielectric Constant 4.1 Glass Transition Temperature (Tg) 125-130°C	1,000 Hours at 85°C/85% RH NASA Low Outgassing RoHS Compliant	Bonding Coating Gap Filling Sealing	Part A: 55,000-110,000 cps, Part B: 8,000-12,000 cps	3-5 minutes setup, full cure within 6-12 hours at 75°F	80-90 Shore D	-60°F to +400°F	/it/tds/ep65ht-1
LED401LV One component LED curable system for high performance bonding, sealing, coating and encapsulation Coefficient of Thermal Expansion 60-65 X 10⁻⁶ in/in/°C Volume Resistivity >10¹⁴ ohm-cm	1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Coating Encapsulation Sealing	60,000-80,000 cps	Cure with LED at 405 nm at ~ 1-4 watts/cm² intensity for 15-30 seconds or longer in thicker sections.	65-75 Shore D	-60°F to +250°F	/it/tds/led401lv
LED405Med One component, nanosilica filled LED curable system Coefficient of Thermal Expansion 35-40 X 10⁻⁶ in/in/°C Dielectric Constant 4.2	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Coating Encapsulation Sealing	2,000-8,000 cps	Cure with LED at 405 nm at ~ 1-4 watts/cm² intensity for 15-30 seconds or longer in thicker sections.	65-75 Shore D	-60°F to +250°F	/it/tds/led405med
LED415DC90 One component, flexibilized LED curable system Tensile Modulus 450,000-550,000 psi Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Coating Encapsulation Gap Filling Sealing	25,000-250,000 cps	Cures rapidly upon exposure to LED light at 405 nm followed by heat curing at 90-95°C for 30-45 minutes	85-90 Shore D	-80°F to +350°F	/it/tds/led415dc90

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