EP110F8-5

Two component, high performance epoxy for potting, sealing, encapsulating and casting
Key Features
  • Enhanced dimensional stability
  • Good toughness
  • Moderate viscosity and long working life
  • Superior electrical insulation properties
Typical Properties
Viscosity
7,000-11,000 cps
Cure Schedule
4-6 hours at 250-300°F
Hardness
70-80 Shore D
Service Temperature Range
-100°F to +300°F
Coefficient of Thermal Expansion
60-70 in/in X 10⁻⁶/°C
Tensile Modulus
35,000-65,000 psi
Immagine
EP110F8-5 Two Part Epoxy
Certifications

ASTM E595 Compliant

Meets EU Directive 2015/863

Packaging
Product Description

Master Bond EP110F8-5 is a two component high performance epoxy resin system with a long pot life (2-3 days at room temperature). It is used primarily for potting, sealing, encapsulating and casting. This moderate viscosity system has a convenient and very forgiving one to two mix ratio by weight. It requires an elevated temperature cure at 250-300°F. A typical cure schedule would be 4-6 hours at 250-300°F. For optimum properties, a post cure of 3-5 hours at 350°F is recommended. It should be noted that even without the optional post cure, EP110F8-5 will perform very well. EP110F8-5 excels especially in its low shrinkage and dimensional stability.

It adheres well to a wide variety of substrates, including metals, composites, glass and many plastics. EP110F8-5 is noteworthy for combining very good electrical insulation properties with enhanced dimensional stability. It has good resistance to thermal cycling as well as impact and vibration. It holds up well to exposure to water, oils and fuels. The color of Part A is tan, while the color of Part B is brown. The service temperature range is -100°F to +300°F. It can used in applications primarily where demanding electrical insulation properties, good resistance to thermal cycling and retention of structural integrity is needed.

Product Advantages

  • Easy processing, convenient 1 to 2 mix ratio by weight
  • Moderate viscosity, good flow
  • Long working life at room temperature
  • Rigid but tough
  • Meets NASA low outgassing
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