EP21ARHTND-2

Master Bond EP21ARHTND-2 is a two component epoxy resin system for high performance bonding, sealing and coating. It has a convenient 100 to 50 mix ratio by weight and is formulated to cure at ambient temperatures, or more quickly at elevated temperatures. Various cure schedules are noted in the chart below, with the optimum cure being overnight at ambient temperature followed by 2-4 hours at 150-200°F. The primary use of this system is for acid resistance, particularly sulfuric and hydrochloric acids. EP21ARHTND-2 has very low linear shrinkage upon cure, is 100% reactive, and contains no solvents or diluents.

This system bonds well to a wide variety of substrates including metals, glass, ceramics, rubbers and plastics. It has excellent physical strength properties, notably high tensile strength. It withstands thermal cycling and has a low coefficient of thermal expansion. It is also a robust electrical insulator. EP21ARHTND-2 has a smooth paste consistency that is especially accommodating for a number of applications including the coating of substrates that might be used in tanks and storage containers. Its viscosity makes using it simple and straight forward, as the epoxy will not flow when applied. The service temperature range is -60°F to +400°F. The color of Parts A and B are amber. EP21ARHTND-2 is widely used in aerospace, electronic, electrical, chemical processing, and in other applications where chemical resistance to acids is needed and a non-drip viscosity is helpful.

Product Advantages

• Convenient handling, 2:1 mix ratio by weight
• Smooth paste consistency
• Good physical strength properties
• Outstanding chemical resistance, particularly to acids
• Withstands 1,000 hours 85°C/85% RH