EP21TDCAOHT

Master Bond EP21TDCAOHT is a two component, thermally conductive, electrically insulating epoxy system that can be used as an adhesive, sealant or coating. It is a paste consistency epoxy with a forgiving one to one mix ratio by weight or volume. It cures at ambient temperatures in 2-3 days or more rapidly at elevated temperatures. The optimum schedule being overnight at room temperature followed by 2-4 hours at 150-200°F. It has low shrinkage upon curing, much less than 0.1%.

EP21TDCAOHT adheres well to a wide variety of substrates, including metals, composites, ceramics, glass, rubbers and plastics. It is a toughened system that is intended to bond dissimilar substrates and to withstand rigorous thermal cycling as well as thermal and mechanical shock. Some other desirable properties include a low coefficient of thermal expansion, standout dimensional stability and very high compressive strength. Its service temperature range is -100°F to +250°F. The color of Part A is gray and Part B is off-white. EP21TDCAOHT can be used in electronic, aerospace and specialty OEM applications, where a toughened, high strength, thermally conductive, electrically insulating epoxy is needed.

Product Advantages

• Convenient mixing and handling
• Versatile cure schedules
• High bonding strength to a wide variety of substrates
• Toughened system, compatible for bonding dissimilar materials
• Thermally conductive and electrically insulative
• Very low shrinkage and high dimensional stability