Master Bond Polymer System EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a ten to one mix ratio by weight. It has an attractive balance of performance properties including high thermal conductivity, superior dimensional stability, mechanical properties, toughness and electrical insulation. EP30FLAO is a low viscosity epoxy with excellent flow characteristics making it ideal as a thermally conductive potting compound. It also has a desirably low coefficient of thermal expansion which makes it an excellent choice for many potting applications. EP30FLAO is an exceptional adhesive/sealant forming durable, flexibilized bonds that are resistant to thermal cycling and chemicals including water, oil and many solvents. It has a wide service temperature range of 4K to +250°F. It can be used in a variety of cryogenic applications. Master Bond EP30FLAO is widely used in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer is required.
Product Advantages
- Easy application: adhesive spreads or pours evenly and smoothly.
- Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required.
- High bond strength to a wide variety of substrates; excellent adhesion properties.
- High thermal conductivity with exceptional electrical insulation properties.
- Low thermal expansion coefficient; superior dimensional stability.
- Good physical strength characteristics and toughness.
- Low viscosity with excellent flowability; ideal for potting and casting.
- Can be used for cryogenic applications.
