EP54TC
Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding and sealing
Key Features
- Thermal conductivity exceeds 6 W/(m•K)
- Applicable in very thin bond lines
- Low thermal resistance
- Low coefficient of thermal expansion
- Passes NASA low outgassing
Typical Properties
Viscosity
100,000-200,000 cps
Cure Schedule
80°C for 2 hours followed by 2-4 hours at 90-125°C. An alternative cure schedule would be 4-6 hours at 80-90°C.
Hardness
85-95 Shore D
Service Temperature Range
-100°F to +400°F
Dielectric Constant
4.7
Thermal Conductivity
41.6-45.1 BTU•in/(ft²•hr•°F) [6.0-6.5 W/(m•K)]
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Applications
Certifications
Meets EU Directive 2015/863
ASTM E595 Compliant
Packaging