EP76M-F

Two component, fast setting, nickel filled epoxy for bonding, sealing and coating
Key Features
  • Nickel conductive
  • Convenient one to one mix ratio
  • Fast fixture time at room temperature
  • Excellent thermal conductivity
  • Serviceable from -60°F to +250°F
    Typical Properties
    Viscosity
    thixotropic
    Cure Schedule
    24-48 hours at 75°F; 1-2 hours at 200°F
    Hardness
    >80 Shore D
    Service Temperature Range
    -60°F to +250°F
    Thermal Conductivity
    8-9 BTU•in/(ft²•hr•°F)
    Volume Resistivity
    5-10 ohm-cm
    Immagine
    EP76M-F Two Part Epoxy
    Certifications

    Meets EU Directive 2015/863

    Packaging
    Product Description

    Master Bond EP76M-F is a two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The outstanding feature of EP76M-F focuses on the faster set up time and full cure of the system when compared to the more standard EP76M. However, it should be noted that EP76M-F has a more limited open time. Unlike the majority of two part nickel conductive systems, EP76M-F has a one to one mix ratio by weight or volume and has no solvents or diluents. It has a paste consistency and is easy to apply.

    The volume resistivity of the cured system is 5-10 ohm-cm. EP76M-F is particularly noteworthy for its strength profile along with good resistance to chemicals including water, oil, and many acids and bases. EP76M-F has a wide temperature range of -60°F to +250°F. Adhesion to metals, composites, ceramics, glass, vulcanized rubbers and many plastics is excellent. Parts A and B are both colored gray. Master Bond EP76M-F is widely used in the electronic, electrical, computer and related industries where shielding and static dissipation are prime requirements, along with faster curing times.

    Product Advantages

    • Convenient mixing: one to one by weight or volume; contains no volatiles
    • Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly
    • Versatile cure schedules; ambient temperature cures or fast elevated temperature cures as required
    • Good electrical and thermal conductivity
    • High bond strength to similar and dissimilar substrates
    • Bonds well to a wide variety of substrates, especially metals and composites
    • Faster set up and cure times
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    How to order

    Verify Your Product Selection

    With thousands of custom formulations available, our expert engineers provide personalized consultation to ensure you select the ideal adhesive. We will follow up with a product and packaging recommendation for your specific application.

    Get a Quote

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    Place Your Order

    We'll work with your company to process the order efficiently.

    Receive Your Material

    Your adhesive will be made to order and shipped to you. Typical lead times are 10-14 business days, with rush options available for urgent orders.