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Master Bond UV15DC80Med is a special dual cure epoxy based system that offers a primary cure using UV light along with a secondary heat curing mechanism. This extraordinary compound also meets USP Class VI specifications and passes ISO 10993-5 testing. UV15DC80Med allows for curing areas on parts that do not allow UV light curing because of “shadowing” issues. It is important to note that the heat curing portion of this system can be initiated at the relatively lower temperature of 80°C.

Master Bond UV15DC80LV-FHC is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curing areas on parts that do not allow UV light curing because of “shadowing” issues. Most noteworthy is that the heat cure portion can be initiated at only 80°C rather than at the more common 125°C. Another very useful feature of a dual cure UV is that it allows for rapid fixturing and then enables the cure to be completed by adding heat.

Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity(<250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other kinds of materials, such as metals, ceramics, composites and other kinds of plastics. When employed as a primer, X21 is applied in a very thin layer on to the polyolefinic piece and the solvent allowed to evaporate.

Master Bond X18 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X18 is a low viscosity(<2,500) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other kinds of materials, such as metals, ceramics, composites and other kinds of plastics. When employed as a primer, X18 is applied in a very thin layer on to the polyolefinic piece and the solvent allowed to evaporate.

Master Bond UV15DC80LV is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curing areas on parts that do not allow UV light curing because of “shadowing” issues. Most noteworthy is that the heat cure portion can be initiated at only 80°C rather than at the more common 125°C. Another very useful feature of a dual cure UV is that it allows for rapid fixturing and then enables the cure to be completed by adding heat.

Master Bond Supreme 10HTF-1 combines very fast curing and simple handling properties with a superior performance profile. It has a smooth paste consistency and is easy to apply. Supreme 10HTF-1 is a true one part system; it is not premixed and frozen and has an unlimited working life at room temperature. It is rapid curing: 5-10 minutes at 300°F or 15-20 minutes at 250°F. It should be noted that post curing at 250-300°F for 1-2 hours will help optimize the properties.

Master Bond EP13SPND-2 is a one component, heat curing epoxy with prominent temperature resistance and stellar bonding attributes. This one part system will cure at temperatures of 300-350°F for 60-90 minutes. For optimum properties, a post cure of 2 hours at 350-400°F is highly recommended. It is primarily used as a structural adhesive. EP13SPND-2 is somewhat exothermic and is typically cured in bond line thickness of 2-8 thousandths of an inch. The system has a paste consistency that is easy to apply and will not flow when cured.