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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP21SC-1 Two component epoxy resin system for bonding, coating and sealing Coefficient of Thermal Expansion 21-24 X 10⁻⁶ in/in/°C Volume Resistivity >10¹⁴ ohm-cm	ASTM D4060-14 for Abrasion Resistance RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	overnight at 75°F plus 2-3 hours at 150-200°F	90-95 Shore D	-60°F to +250°F	/de/tds/ep21sc-1
EP21TDC Versatile, toughened two component epoxy for bonding, sealing and coating T-peel Strength 20-30 pli Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling Encapsulation	Part A: 11,000-16,000 cps, Part B: 70,000-140,000 cps	overnight at 75°F, followed by 1-2 hours at 150-200°F	>60 Shore D	-100°F to +250°F	/de/tds/ep21tdc
EP21TDC-2 Two component, highly flexibilized epoxy resin compound Elongation >120% T-peel Strength >30 pli	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 10,000-20,000 cps, Part B: 150,000-300,000 cps	overnight at 75°F followed by 2-3 hours at 150-200°F	75-80 Shore A	4K to +250°F	/de/tds/ep21tdc-2
EP21TDC-2AO Two component, room temperature curing, thermally conductive, electrically insulative epoxy system Elongation 50-100% T-peel Strength 10-20 pli	RoHS Compliant	Bonding Sealing Coating Encapsulation	Part A: 30,000-80,000 cps, Part B: 300,000-600,000 cps	overnight at 75°F, followed by 2-4 hours at 150-200°F	30-40 Shore D	4K to +250°F	/de/tds/ep21tdc-2ao
EP21TDC-2AOLV Two component, room temperature curing, thermally conductive, electrically insulative epoxy system Elongation 50-100% T-peel Strength 10-20 pli	RoHS Compliant	Bonding Sealing Gap Filling Encapsulation Coating	Part A: 1,000-5,000 cps, Part B: 300,000-600,000 cps	75°F: 48-72 hours; 200°F: 2-3 hours	30-40 Shore D	4K to +250°F	/tds/ep21tdc-2aolv
EP21TDC-2LOND Two component, highly flexibilized epoxy resin compound Tensile Modulus 2,000-7,000 psi Volume Resistivity >10¹³ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation	paste	75°F for 48-72 hours, 200°F for 2-3 hours	30-40 Shore D	4K to +250°F	/de/tds/ep21tdc-2lond
EP21TDC-2ND Two component, highly flexibilized, non-drip epoxy resin compound Dielectric Constant 3.6 Elongation >120%	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: paste, Part B: paste	overnight at 75°F followed by 2-3 hours at 150-200°F	70-80 Shore A	4K to +250°F	/de/tds/ep21tdc-2nd
EP21TDC-4 Two component, highly flexibilized epoxy for bonding, sealing and coating Elongation 100-150% Volume Resistivity >10¹⁴ ohm-cm	1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 9,000-14,000 cps, Part B: 200,000-300,000 cps	12 hours at 75°F followed by 3-5 hours at 140-160°F	75-85 Shore A	-100°F to +250°F	/de/tds/ep21tdc-4
EP21TDC-4ND Two component, highly flexibilized epoxy for bonding, sealing and coating Elongation 100-200% Tensile Lap Shear Strength >850 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	overnight at 75°F followed by 3-4 hours at 150-200°F	75-80 Shore A	-100°F to +250°F	/de/tds/ep21tdc-4nd
EP21TDC-7 Two component, highly flexibilized epoxy for bonding, sealing and coating Elongation >200% Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating	Part A: 9,000-14,000 cps, Part B: 200,000-300,000 cps	12 hours at 75°F followed by 3-5 hours at 140-160°F	65-75 Shore A	-100°F to +250°F	/de/tds/ep21tdc-7

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