EP21TDC-2AOLV

Master Bond EP21TDC-2AOLV is a two component thermally conductive, electrically insulating epoxy that is very flexible upon curing. It can be used for bonding sealing, coating and encapsulation. In essence, this epoxy system is a lower viscosity version of EP21TDC-2AO. It has a forgiving one to three mix ratio by weight and upon mixing, has a thicker consistency, but good flow. This system will cure at ambient temperatures or more quickly at elevated temperatures (see below). The optimum cure is typically overnight at room temperature, followed by 2-4 hours at 150-200°F. Some other noteworthy features are its long working life, low shrinkage upon curing and very good dimensional stability.

EP21TDC-2AOLV is an excellent adhesive and bonds well to a wide variety of substrates including metals, glass, composites, ceramics as well as many rubbers and plastics. Because of its flexible cure, this system can withstand rigorous thermal cycling and shock. It is a good conductor of heat, and still is a very potent electrical insulator. It has good resistance to many chemicals including water, oils, fuels as well as cleaning agents and solvents. It is cryogenically serviceable and its temperature range is from 4K to 250°F. The color of Part A is gray and Part B is off-white. EP21TDC-2AOLV has a very special product property profile and it has been used successfully in numerous aerospace, electronic, opto-electronic, specialty OEM applications where this unusual blend of properties is advantageous.

Product Advantages

• Non-critical one to three weight ratio by weight
• Versatile cure schedules; ambient temperature cures or faster, elevated temperature cures
• High shear and peel strength as well as elongation
• Exceptional resistance to thermal cycling and shock
• Multifunctional, can be used for bonding, sealing,coating and encapsulation
• Cryogenically serviceable