EP21TCHT-1

Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. EP21TCHT-1 has a 100:60 mix ratio by weight. Most significantly, it passes NASA low outgassing tests with exceptionally sterling numbers. EP21TCHT-1 offers an array of outstanding physical properties once cured. The system is an excellent, high strength adhesive that conducts heat, yet is electrically insulative. This epoxy can withstand rigorous thermal cycling and shocks. It is highly distinctive in that it possesses high temperature resistance as well as superlative cryogenic serviceabililty. Its actual service temperature range is from 4K to +400°F. It bonds well to a wide variety of substrates, including composites, metals, ceramics, glass and many rubbers and plastics. EP21TCHT-1 resists many chemicals including water, oils, fuels and many acids and bases. Its thermal expansion coefficient is remarkably low, as indicated below. For an epoxy system, its dimensional stability is second to none. The color of Part A and Part B is off-white. EP21TCHT-1 is widely used in aerospace, electronics, electrical, semiconductor, and cryogenic applications. As a NASA qualified system, it is ideal for high vacuum type applications, particularly those where only slightly elevated temperature cures are possible. However, the best curing schedule to optimize properties is overnight at room temperature followed by 2 hours at 175-200°F.

Product Advantages

• Easy to apply paste consistency
• Good thermal conductivity and electrical insulation
• NASA low outgassing
• Very low CTE
• Passes fungus resistance MIL-STD-810G