EP30LTE

Master Bond EP30LTE is a specialty epoxy system featuring exceptionally low coefficient of thermal expansion (CTE). Also noteworthy is its superior dimensional stability. It can be used in bonding, coating, sealing and encapsulation applications. This lower viscosity system will cure at room temperature or more quickly at elevated temperatures. To optimize the properties, it is recommended to cure at room temperature for 12-24 hours, followed by a post cure of a few hours at 150-200°F. The CTE is in the range of 15-18 x 10^-6 in/in/°C; markedly lower than other systems. Additionally, it has good thermal conductivity and is highly electrically insulative. Its linear shrinkage upon curing is exceptionally low, less than 0.01%.

EP30LTE bonds well to a wide variety of substrates including metals, glass, ceramics and many rubbers and plastics. It is 100% reactive and does not contain any solvents or diluents. This system offers excellent resistance to many chemicals, such as water, fuels and oils, as well as a number of acids and bases. It is serviceable over the wide temperature range of -100°F to +250°F. Part A of this system is off white in color and Part B is clear. Master Bond EP30LTE is especially used in aerospace, optical, electronic, specialty OEM and other applications where an ultra low CTE along with dimensional stability is desirable.

Product Advantages

• 100% reactive, contains no diluents or solvents
• Very low shrinkage upon cure
• Lower viscosity; good flow properties — ideal for small to moderate sized castings
• Exceptionally low thermal expansion coefficient: about 15-18 x 10^-6 in/in/°C
• Good thermal conductivity while still electrically insulative
• Superior dimensional stability