EP33LV
Two component, lower viscosity epoxy adhesive for bonding, sealing and coating
Key Features
- Suitable for bonding, sealing and coating
- Room temperature curing
- Easy machinability
- Moderate viscosity with good flow
- High dimensional stability
- Serviceable up to +450°F
Typical Properties
Viscosity
14,000-18,000 cps
Cure Schedule
overnight at 75°F followed by a post cure at 150-200°F for 2-3 hours
Hardness
85-90 Shore D
Service Temperature Range
-60°F to +450°F
Dielectric Constant
5.5
Tensile Lap Shear Strength
2,000-2,200 psi
Bild

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Applications
Certifications
Meets EU Directive 2015/863
Packaging