EP3HTS-TC

One component, silver filled epoxy featuring extraordinary electrical and thermal conductivity
Key Features
  • For bonding, sealing and coating
  • Not premixed and frozen
  • Very long open time at room temperature
  • Cures rapidly at 250-300°F
Typical Properties
Viscosity
paste
Cure Schedule
Cures rapidly at 250 to 300°F
Hardness
60-70 Shore D
Service Temperature Range
-80°F to +400°F
Thermal Conductivity
110-118 BTU•in/(ft²•hr•°F) [16-17 W/(m•K)]
Volume Resistivity
<1x10⁻³ ohm-cm
Bild
One Part, Silver Filled Epoxy EP3HTS-TC
Certifications

ASTM E595 Compliant

Meets EU Directive 2015/863

Product Description

Master Bond EP3HTS-TC is a fast curing, silver filled, one part epoxy with unparalleled electrical and thermal conductivity. It is not premixed and frozen and has an unlimited working life at room temperature. It has a paste consistency and dispenses easily from a syringe. It cures rapidly at 250 to 300°F with minimal flow and low shrinkage upon curing. This epoxy should be stored in a refrigerator at 40 to 50°F.

Although this product can be used for sealing and coating, its main use is as an adhesive for die attach and general bonding purposes. EP3HTS-TC bonds well to a wide variety of substrates including metals, composites, ceramics, and many plastics. As a die attach adhesive, it dispenses smoothly and easily. It is well suited for automatic dispensing equipment and can be applied without any tailing. For other types of bonding, it combines remarkable thermal and electrical conductivity. In fact, the thermal conductivity exceeds 16 W/(m·k). Along with this, the maximum particle size is about 20 microns, and when these numbers are combined, the thermal resistance is a remarkable 1-5 x 10-6 K·m2/W. Other desirable attributes include excellent dimensional stability, resistance to thermal cycling, and a low coefficient of thermal expansion. The temperature range is -80°F to +400°F. EP3HTS-TC also passes NASA low outgassing specifications. There are 2 scenarios where EP3HTS-TC would be a top candidate. The first is in applications where the lowest possible volume resistivity is required. The second is when pre-eminent thermal conductivity is necessary and the need for electrical conductivity is not a pertinent issue.

Product Advantages

  • Single component system, no mixing needed
  • Not premixed and frozen, unlimited working life
  • Ideal viscosity for die attach and general bonding
  • Spectacular electrical and thermal conductivity
  • NASA low outgassing
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How to order

Verify Your Product Selection

With thousands of custom formulations available, our expert engineers provide personalized consultation to ensure you select the ideal adhesive. We will follow up with a product and packaging recommendation for your specific application.

Get a Quote

Our customer service team will follow up with a detailed quote with packaging and shipping options.

Place Your Order

We'll work with your company to process the order efficiently.

Receive Your Material

Your adhesive will be made to order and shipped to you. Typical lead times are 10-14 business days, with rush options available for urgent orders.