EP31ND

Master Bond EP31ND is a two part epoxy system used mostly for bonding, but is also serviceable for sealing and encapsulation. This compound has a forgiving mix ratio of 100 to 30 by weight and contains no solvents or diluents. It cures readily at room temperature or more rapidly at elevated temperatures. At ambient temperatures it cures in about 1-2 days, and at 200°F, the curing time is about 2-3 hours. To optimize properties, an overnight cure at room temperature followed by 2-3 hours at 150-200°F is desirable. After polymerizing, EP31ND has toughness and resiliency allowing it to withstand aggressive thermal cycling. In conjunction with this, it holds up to thermal and mechanical shock very well. It is most noteworthy for its formidable tensile lap shear and peel strength. Also, it bonds well to a wide variety of substrates, including metals, composites, glass, rubber, ceramics and many plastics. Some other desirable attributes include chemical resistance to water, oils and fuels, along with low shrinkage upon curing. It is a superb electrical insulator, which, and with its non-flow viscosity, it can be used to seal and protect electronics and other components. The color of Part A is clear and Part B is light amber and it should be noted that other colors are available upon request. Its service temperature range is -60°F to +250°F. The primary focus of EP31ND is as a structural adhesive with its aforementioned high strength bonding profile. Therefore, EP31ND is applicable in aerospace, electronic, optical, optoelectronic, specialty OEM and related industries, where this special product profile would be advantageous.

Product Advantages

• User friendly handling and processing
• Versatile cure schedules
• Non-drip application feature
• Stellar lap shear and peel strength properties
• Top notch electrical insulation properties