EP17HTND-CCM

One component, high temperature resistant epoxy system for bonding and sealing
Key Features
  • Ideal for glob top applications
  • Resists temperatures up to +550°F
  • Excellent chemical resistance
  • Meets NASA low outgassing specifications
Typical Properties
Viscosity
Paste
Cure Schedule
Typical curing schedules are 2 hours at 300°F or 1-2 hours at 350°F.
Hardness
80-90 Shore D
Service Temperature Range
-80°F to +550°F
Glass Transition Temperature (Tg)
160-165°C
Tensile Lap Shear Strength
2,400-2,600 psi
EP17HTND-CCM One Part Epoxy
Discuss with a Specialist
(1-2 Business Day Request) Get Technical Data sheet
(Instant Email Delivery) Request Safety Data sheet
(1-2 Business Day Request)
Applications

Bonding

bonding

Sealing

sealing

Encapsulation

encapsulation

Coating

Coating
Certifications

ASTM E595 Compliant

Meets EU Directive 2015/863

Packaging

Syringe

Product Description

Master Bond EP17HTND-CCM is a one component, heat cured epoxy system for bonding, sealing and glob top applications. It requires no mixing and cures readily at 300-350°F. Typical curing schedules are 2 hours at 300°F or 1-2 hours at 350°F. Curing in this manner will optimize properties. EP17HTND-CCM has a great flow profile for glob top applications and is black as well.

This epoxy system features excellent physical properties, superb electrical insulation along with good thermal conductivity, even at elevated temperatures. This system is also distinctive in that it has a relatively low exotherm upon curing. EP17HTND-CCM is 100% reactive and contains no solvents or diluents. EP17HTND-CCM bonds well to similar and dissimilar substrates such as metal, ceramics, plastics and composites. It has a noteworthy resistance to many chemicals including acids, bases, salts, fuels, oils and many solvents. Significantly, It has minimal shrinkage upon curing. Its service temperature range is from -80°F to +550°F. Since it passes NASA low outgassing, it can be used in vacuum type situations and other applications where that requirement is needed. EP17HTND-CCM is used primarily as a glob top and sealing material in electronic applications where high temperature resistance and good electrical properties at these high temperatures is needed.

Product Advantages

  • Single component system; no mixing prior to use
  • High temperature resistance
  • Very good electrical insulation properties, even at higher temperatures
  • Black color
  • Ideal flow profile for glob topping
  • Good thermal conductivity
Discuss with a Specialist
(1-2 Business Day Request) Get Technical Data sheet
(Instant Email Delivery) Request Safety Data sheet
(1-2 Business Day Request)
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How to order

Verify Your Product Selection

With thousands of custom formulations available, our expert engineers provide personalized consultation to ensure you select the ideal adhesive. We will follow up with a product and packaging recommendation for your specific application.

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Receive Your Material

Your adhesive will be made to order and shipped to you. Typical lead times are 10-14 business days, with rush options available for urgent orders.

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