EP21TDCS-LO
Durable, high strength two component epoxy for bonding and sealing
Key Features
- Low volume resistivity
- Outstanding toughness
- Cryogenically serviceable
- Passes ASTM E595 for NASA low outgassing
Typical Properties
Viscosity
paste
Cure Schedule
Optimum cure schedule: Overnight at 75°F followed by 2-3 hours at 135-165°F.
Hardness
40-50 Shore D
Service Temperature Range
4K to +275°F
Tensile Lap Shear Strength
600-800 psi
Volume Resistivity
0.001 ohm-cm
Imagen

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Applications
Certifications
ASTM E595 Compliant
Meets EU Directive 2015/863
Packaging
Case Study
EP21TDCS-LO: A Conductive Bonding Agent for Space-Environment Assemblies
Conductive bonding agents play a fundamental role in ensuring reliable electrical connectivity in many electromechanical assemblies designed to operate at the extremes of temperature and pressure of space. Failure of a single bond between conductive …