EP21QF

Master Bond EP21QF is a two component epoxy adhesive, sealant, coating, and encapsulating system combining outstanding physical properties, along with exceptionally easy processing. It cures at room temperature or more quickly at elevated temperatures. A 22 gram mass will cure in 1 hour at 65°C. is A summary of additional curing schedule options is presented in the chart below. EP21QF is notable for its superb dimensional stability and low shrinkage upon curing.

EP21QF bonds well to a wide variety of substrates including metals, composites, glass, ceramics and many rubbers and plastics. It withstands rigorous thermal cycling, as well as vibration and shock. This epoxy resists water, oils, fuels and many salts. The service temperature range is from -80°F to +300°F. The system is color coded, with Part A being black, and Part B white, and upon mixing, the color becomes gray. Most importantly, EP21QF conducts heat while retaining electrical insulation. It is a versatile system with potential usage in electronic, electrical, aerospace, and specialty OEM type applications.

Product Advantages

• Forgiving 1:1 mix ratio by weight or volume
• Excellent flow properties
• Robust physical strength profile
• Low shrinkage and good dimensional stability
• Good heat conduction
• Superior dielectric properties