EP4S-80

Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. It is low in viscosity and flows smoothly and easily. This epoxy simply requires heat for curing. The cure schedule is straightforward, 60 to 90 minutes at 80°C. EP4S-80 is available in both syringes and jars. Syringes are shipped in dry ice, stored in a cryogenic freezer, and packaged for one time use. Upon thawing, it is recommended to use the syringe within 6 hours, and any remaining material then be discarded. When packaged in jars there are no shipping restrictions. Upon arrival, the jar is stored in a refrigerator and best used within a 12 hour time frame, with occasional stirring to prevent the silver filler from settling out. Jars then should be returned to the refrigerator for reuse. This epoxy has no solvents or diluents, and very low shrinkage upon curing.

EP4S-80 bonds well to a wide variety of substrates such as metals, ceramics, composites, and many plastics. It is a high modulus, high compressive strength system. Its electrical conductivity is excellent, with a volume resistivity less than 0.001 ohm-cm. The epoxy has good dimensional stability. EP4S-80 fits very nicely in bonding, sealing and gap filling applications, including lid & chip attachment, microelectronics, semiconductor packaging, and EMI/RFI shielding. It can also be considered for specialty encapsulation type applications where electrical conductivity is needed. This system resists water, oils and fuels. The service temperature range is -60°C to +150°C. EP4S-80 should be considered in a broad array of applications including opto-electronics, acoustical, automotive systems, PCB assembly, among many others where a one part, low viscosity, highly electrically conductive epoxy is needed.

Product Advantages

• One component
• Will not cure until heated
• Curing temperature 80°C
• Low viscosity
• Excellent electrical conductivity