EP79

Master Bond EP79 is a two component, electrically conductive epoxy for high performance bonding, coating and sealing. Most significantly, it contains silver coated nickel as the conductive filler and can be considered a cost effective alternative to more standard silver filled epoxy systems. EP79 has a convenient one to one mix ratio by weight, and it cures readily at room temperature or more rapidly at elevated temperatures. To optimize its properties, the recommended cure schedule is overnight at room temperature followed by a post cure of 1-2 hours at 150-200°F. It has low linear shrinkage upon cure. It possesses reasonably good bond strength and has superior toughness, which allows the system to be subjected to thermal cycling and shocks. Due to the nature of the filler, it exhibits superb thermal conductivity. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity is exceptionally low—less than 0.005 ohm-cm.

EP79 can be applied readily with brush and has good flow properties. The system is conducive to thermal cycling over the exceptionally wide temperature range of 4K to +275°F, enabling it to be serviceable even in cryogenic applications. It has good chemical resistance to water, oils and fuels. Adhesion to metals, composites, glass, ceramics, vulcanized rubbers and many plastics is excellent. Parts A and B are both colored gray. Master Bond EP79 adhesive is widely used in the electronic, aerospace, computer, semiconductor and electro-optic industries, among others.

Product Advantages

• Convenient mixing: one to one ratio by weight
• Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly
• Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required
• Very low volume resistivity(<0.005 ohm-cm)
• Cost effective alternative to silver filled epoxy
• Good bond strength to a variety of substrates