EP4EN-80

One component flowable epoxy for bonding and small encapsulation applications with a curing schedule at 80°C to 85°C
Key Features
  • Thermally conductive, electrically insulating
  • Ultra fine particle size
  • Can cure up to 1/4 inch thick
  • High modulus and compressive strength
Typical Properties
Viscosity
600-1,800 cps
Cure Schedule
90 minutes at 65°C plus 30 minutes at 80-85°C
Hardness
85-95 Shore D
Service Temperature Range
-58°F to +302°F
Dielectric Constant
4.4
Thermal Conductivity
5.2-5.9 BTU•in/(ft²•hr•°F) [0.75-0.85 W/(m•K)]
EP4EN-80 One Component Epoxy
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(1-2 Business Day Request) Get Technical Data sheet
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Applications

Bonding

bonding

Encapsulation

encapsulation

Potting

potting
Certifications

ASTM E595 Compliant

Meets EU Directive 2015/863

Packaging

Can

Jar

Pail

Product Description

Master Bond EP4EN-80 is a one component, low viscosity epoxy mainly for potting applications. Curing is simple and straightforward, 90 minutes at 65°C plus 30 minutes at 80 to 85°C. The working life is 12-24 hours and any leftover material can be returned to the refrigerator for future use.

It has a thermally conductive, electrically insulative filler material with ultra small particle sizes. This imparts high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing.

EP4EN-80 is primarily for potting and encapsulation up to 1/4 inch thick. It is very low in viscosity and free flowing. Usually one part epoxies are too exothermic to be used in this fashion, but this system is specially formulated for lower heat generation.

EP4EN-80 bonds well to a variety of substrates such as metals, composites, ceramics and many plastics. It is electrically isolating and transfers heat very effectively. Also noteworthy is its high modulus and compressive strength. EP4EN-80 can also be used as an adhesive. Because the particles are so small it can be applied in thicknesses ranging from 10-15 microns. The combination of thin bond lines and thermal conductivity lowers the thermal resistance to 10-20 x 10-6 K•m2/W. This is a big positive in managing heat related issues. EP4EN-80 will resist waters, oils and fuels. Its color is gray. The service temperature range is -50°C to +150°C. The fact that this one part system with curing temperatures not exceeding 85°C, along with the other desirable properties mentioned above, offers an attractive option for small encapsulation applications in microelectronics.

Product Advantages

  • Single component; no mixing needed
  • Reusable when refrigerated
  • Easy to manage curing schedule
  • Highly useful potting epoxy
  • Low thermal resistant adhesive
  • Passes NASA low outgassing specifications
Discuss with a Specialist
(1-2 Business Day Request) Get Technical Data sheet
(Instant Email Delivery) Request Safety Data sheet
(1-2 Business Day Request)
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How to order

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