EP21TDCS

Master Bond EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding, sealing and coating. It has a forgiving one to one mix ratio by weight. Upon mixing Parts A and B, the epoxy is thixotropic and flowable. It is formulated to cure at room temperature or more rapidly at elevated temperatures. The optimum cure schedule is overnight followed by a post cure of 1-2 hours at 150-200°F. This system features high dimensional stability along with low shrinkage upon curing.

EP21TDCS bonds well to a wide variety of substrates, including composites, metals, glass, ceramics, vulcanized rubbers and many plastics. It is a toughened system which allows it to withstand rigorous thermal cycling as well as vibration and shock. This epoxy is an outstanding conductor of both heat and electricity. The volume resistivity is less than 10-3 ohm-cm; it retains this value well beyond 10 years. EP21TDCS is cryogenically serviceable over the temperature range of 4K to +275°F. Also, it has good chemical resistance to water, oils and fuels. It is an extremely versatile system that can be used in a wide array of electronic, semiconductor, microwave, electro-optic and aerospace applications. It is well established for use in die attach and surface mount applications. The combination of easy handling and formidable properties after curing has made this a “go-to” material in the realm of conductive epoxies.

Product Advantages

• Forgiving 1:1 mix ratio by weight
• Thixotropic and flowable with versatile cure schedules
• Cryogenically serviceable
• Superb retention of conductivity
• For surface mount bonding and die attachment
• Electrically conductive gasketing
• Suitable for flip chip die attaching
• Used in membrane switches and solar cells