EP30AO

Master Bond EP30AO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures with a ten to one mix ratio by weight. This system has an attractive balance of performance properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as outstanding physical strength properties. EP30AO has a low viscosity with excellent flow characteristics making it ideal as a thermally conductive, potting epoxy. EP30AO is also a superb adhesive/sealant forming durable, rigid bonds that are resistant to thermal cycling and chemicals including water, oils and most solvents, over the wide temperature range of -60°F to +250°F. The thermal expansion coefficient is desirably low. Color of Part A is off white, Part B is clear. EP30AO is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation and environmental protection are required and heat transfer must be maintained.

Product Advantages

• Smooth and even flow profile
• Very low shrinkage upon curing
• Low coefficient of thermal expansion
• High compressive strength
• Tested for abrasion resistance per ASTM D4060-14