EP30LTE-2
Two component, room temperature curing epoxy for bonding, sealing, coating and encapsulating with low coefficient of thermal expansion
Key Features
- Thermally and electrically insulating
- Good flow properties
- Low shrinkage upon cure
- Superior dimensional stability
Typical Properties
Viscosity
70,000-100,000 cps
Cure Schedule
overnight at 75°F followed by 2-4 hours at 150-200°F
Hardness
85-95 Shore D
Service Temperature Range
4K to +250°F
Acoustical Impedance
6.4 MRayl
Coefficient of Thermal Expansion
10-13 X 10⁻⁶ in/in/°C
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Applications
Certifications
ASTM E595 Compliant
Meets EU Directive 2015/863
Packaging