EP36

One component, B-staged epoxy for potting, encapsulation, coating and bonding
Key Features
  • Available in 30 gram cookies
  • High temperature resistant
  • Flexibilized and toughened
  • Unlimited working life at room temperature
Typical Properties
Viscosity
80,000-120,000 cps
Cure Schedule
350°F for 2-3 hours
Hardness
80 Shore D
Service Temperature Range
-100°F to +500°F
Glass Transition Temperature (Tg)
95-100°F [35-37.8°C]
Volume Resistivity
>10¹⁴ ohm-cm
Immagine
EP36 One Part B-Stage Epoxy
Certifications

Meets EU Directive 2015/863

Packaging
Product Description

Master Bond EP36 is a unique one component, high performance epoxy for bonding, encapsulation, potting and coating. It differs greatly from other heat resistant epoxies as it has far more toughness and flexibility at elevated temperatures. Its forgiving nature at high temperatures imparts vastly superior thermal and mechanical shock resistance as well as the capability of withstanding aggressive thermal cycling especially when compared to more standard high temperature resistant epoxies. EP36 bonds well to a variety of substrates including metals, composites, glass and many plastics. It is also noteworthy for good chemical resistance and excellent electrical insulation properties. This one component system is primarily used for potting but can also be used for bonding and sealing. The service temperature range is -100°F to +500°F.

As mentioned above, EP36 retains toughness and heat resistance up to 500°F without losing its critical properties. The hardness remains consistent (20-30 Shore D) above its Tg, and it is still able to withstand rigorous thermal cycling. EP36 is ideal for potting and encapsulation applications where a superb electrical insulator and the ability to withstand severe thermal cycling over a wide temperature range are needed.

While EP36 is an unconventional epoxy, it is conveniently available in 30 gram cookies as well as pints and quarts. This system is formulated at elevated temperatures and poured into cans or 30 gram cookie molds and solidifies. Since it is a solid; it must be heated in a forced air or convection oven at 200°F for about 30 minutes to transform it to a liquid. The working life at this temperature is 60-75 minutes. To complete the cure, the temperature should be 350°F for 2-3 hours. When liquefied, it is easy to apply as an encapsulant or an adhesive. Liquefied but uncured material can be reused by allowing EP36 to resolidify at room temperature. Cured material cannot reliquefy; resolidified epoxy can become liquid again. This epoxy is beige in color. A more detailed description of curing the 30 gram cookie appears in the cure section below. EP36 is truly a specialty type system that is primarily used in electronic and aerospace applications.

Product Advantages

  • One component system
  • Superb electrical insulation properties
  • Combines flexibility and toughness with high temperature resistance
  • Ideal for potting and encapsulation
  • Unused material is easy to reprocess
  • Available in conveniently prepared 30 gram cookies
  • Capable of withstanding rigorous thermal cycling and thermal shocks
Show More

How to order

Verify Your Product Selection

With thousands of custom formulations available, our expert engineers provide personalized consultation to ensure you select the ideal adhesive. We will follow up with a product and packaging recommendation for your specific application.

Get a Quote

Our customer service team will follow up with a detailed quote with packaging and shipping options.

Place Your Order

We'll work with your company to process the order efficiently.

Receive Your Material

Your adhesive will be made to order and shipped to you. Typical lead times are 10-14 business days, with rush options available for urgent orders.