News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications Release Date: 10/03/2016 Product: MasterSil 973S-LO Well suited for use in vacuum environments, Master Bond MasterSil 973S-LO is an adhesive, sealant and coating that passes NASA low outgassing tests. This electrically conductive, two component silicone can be used in the aerospace, electronic, opto-electronic and specialty OEM industries. Featuring a low volume… Read More...
	Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission Release Date: 09/12/2016 Product: EP30-2LB Formulated for specific optical applications, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. This two part system is optically clear with a refractive index of 1.55. It also passes ASTM E595 testing to meet NASA low outgassing specifications. Beyond… Read More...
	Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications Release Date: 08/22/2016 Product: EP21TDCN-LO Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This… Read More...
	Solvent Resistant Adhesive Withstands Methylene Chloride, Alcohols and Fuels Release Date: 08/01/2016 Product: EP41S-5 Formulated for bonding, sealing, coating and encapsulation applications, Master Bond EP41S-5 is a room temperature curing epoxy that combines a high strength profile, superior electrical insulation values and exceptional chemical resistance. This system can be used in the aerospace, electronic, power, chemical processing,… Read More...
	No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications Release Date: 07/11/2016 Product: EP3UF Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10^-6 K•m²/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal… Read More...