News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Toughened Two Part Epoxy Adhesive/Sealant Meets NASA Low Outgassing Specifications Release Date: 11/11/2010 Product: EP21TDCHT-LO Master Bond's EP21TDCHT-LO two part epoxy adhesive/sealant is specially formulated for demanding applications where factors like temperature cycling, high vibration, and mechanical shock are an issue. It meets NASA low outgassing specifications. This versatile system is used for a wide variety of structural, electronic,… Read More...
	Long-Lasting Epoxy System Resists Fuels, Acids & Other Aggressive Chemicals Release Date: 10/21/2010 Product: EP21ARHT Developed for coating and lining storage tanks, piping, scrubbers, and processing equipment in the chemical industry, Master Bond EP21ARHT features outstanding chemical, fuel, and acid resistance. Also widely used in electronic, electrical, and metalworking industries, it can even successfully withstand immersion to 96-98%… Read More...
	Ultra-Fast Curing, Thermally Stable Epoxy Meets NASA Low Outgassing Specifications Release Date: 09/30/2010 Product: EP65HT-1 Master Bond EP65HT-1 combines high temperature resistance and fast room temperature curing in a NASA low outgassing approved epoxy. It also offers superior electrical insulation capabilities and strong chemical resistance. With an extremely high glass transition temperature exceeding 125ºC, EP65HT-1 features fast cure… Read More...
	Room Temperature Curing, Flexibilized Epoxy Combines High Strength and Toughness with Chemical and Abrasion Resistance Release Date: 09/07/2010 Product: EP30D-7 Combining the benefits of epoxy resins and polyurethanes, Master Bond Polymer System EP30D-7 offers superior strength, flexibility, abrasion resistance and toughness. This two component epoxy is ideal for high performance bonding, sealing, coating, and encapsulating applications in the electronic, electrical, computer,… Read More...
	Thermally Conductive, Low Viscosity Epoxy Features Cryogenic Serviceability Release Date: 08/12/2010 Product: EP30FLAO Master Bond EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is extremely versatile and can be used in a wide variety of cryogenic applications. This low viscosity epoxy with excellent flow characteristics makes it ideal as a thermally conductive potting compound. It… Read More...