News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	New Epoxy Adhesive Serviceable At Cryogenic Temperatures Release Date: 05/01/2008 Product: EP29LPSP Master Bond Inc., Hackensack, N.J. has introduced a new two component epoxy adhesive/sealant for cryogenic applications. Called EP29LPSP, this compound is able to withstand temperatures as low as 4K. Additionally, it is able to resist cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute… Read More...
	New Polymer System Cures by UV Light and/or Heat Release Date: 03/11/2008 Product: UV15-7DC Master Bond Inc., Hackensack, N.J. has introduced a new one component, optically clear, non-yellowing UV and/or heat curable polymer system called UV15-7DC. This high performance system is designed for bonding, sealing and coating applications. It is 100% reactive and does not contain any solvents or other volatiles. UV15-7DC… Read More...
	New Flexible, Low Viscosity Potting Compound Release Date: 02/04/2008 Product: EP30FL A new flexible, tough epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond Inc., Hackensack, NJ. Master Bond EP30FL has extraordinarily low viscosity and is easy to apply. It can be used in both thick and thin cross sections. This compound is 100% reactive and does not contain any… Read More...
	New Highly Flexible Silver Conductive Epoxy Adhesive Release Date: 10/05/2007 Product: EP21TDCSFL Master Bond EP21TDCSFL is a new two component, room temperature curing, silver filled, epoxy adhesive developed by Master Bond Inc., Hackensack, N.J. It exhibits high flexibility and has an elongation of >60%. EP21TDCSFL is easy to use and has a 1 to 1 mix ratio by weight or volume. It cures at room temperatures or more… Read More...
	New Flexible Low Viscosity Silicone Compound Release Date: 08/30/2007 Product: MasterSil 151 MasterSil 151 is a new two component, low viscosity silicone compound for high performance casting, potting and encapsulation introduced by Master Bond Inc., Hackensack, N.J. This formulation is designed to cure at room temperature or more rapidly at elevated temperatures. MasterSil 151 has superior electrical insulation… Read More...