EP113

Master Bond EP113 is a two component, nanosilica filled epoxy system for potting, coating and sealing. The addition of the nano particles enhances the dimensional stability and the already exceptionally low shrinkage upon curing. EP113 has a 100 to 80 mix ratio by weight. It has an unusually low viscosity along with an especially long open time of 2-4 days. It should be noted that EP113 requires oven curing. A typical cure schedule is 2-3 hours at 250°F followed by 5-8 hours at 300°F with a 2 hour or longer post cure at 350°F, although, a number of variations are possible.

EP113 is a top tier electrical insulator. It bonds well to a wide variety of substrates including metals, composites, glass, ceramics and plastics. As a toughened system, it has good resistance to thermal cycling and shock. When the aforementioned properties are combined with its pronounced low viscosity, it is a highly attractive candidate for potting and encapsulating. Some other positive features include its excellent physical strength profile as well as its chemical resistance to water, oils, acids, bases and fuels. The service temperature range is -100°F to +450°F. EP113 is a versatile, specialty type system that can be used in many different aerospace, electronic and OEM applications where this uncommon blend of product properties is desirable.

Product Advantages

• Low viscosity
• Extraordinarily long open time
• Can withstand rigorous thermal cycling
• Marvelous electrical insulation properties
• Great optical clarity
• Tested for abrasion resistance per ASTM D4060-14