EP19HTFL

Master Bond EP19HTFL is a one component very low viscosity epoxy for high performance impregnation, coating and sealing. It has unlimited working life at room temperature as it requires an elevated temperature cure at 250-300°F. The optimum curing schedule is 1 hour at 250°F followed by a post cure of 1-2 hours at 300-350°F. EP19HTFL is a toughened system with an enhanced capability of withstanding thermal cycling along with very good impact resistance. It bonds well to a wide variety of substrates such as ceramics, metals, composites, glass and many plastics. It combines outstanding physical strength properties with compelling electrical insulation properties. It has first rate chemical resistance to water, oils, fuels and many solvents. Its low viscosity allows for easy brushing or spraying for the surfaces to be impregnated, laminated or sealed. It is a light amber clear system and the service temperature range is -60°F to +350°F. EP19HTFL has an exceptionally low viscosity, impressive physical property profile and easy handling. This combination enables it to be a wonderful product for specialty aerospace, electronic and OEM type applications where surfaces, especially metals and ceramics, require impregnation, lamination or coating. When impregnating, it is most effective when applied under vacuum, although this is not mandatory.

Product Advantages

• Ultra low viscosity; ideal for impregnation applications
• Unlimited working life at room temperature
• Excellent physical strength properties
• Outstanding electrical insulation
• Superior heat resistance
• Toughened system, capable of withstanding rigorous thermal cycling