EP21TDC-2AN

Master Bond Polymer System EP21TDC-2AN is a two component flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. This system’s exceptional thermal conductivity is particularly noteworthy. It is formulated to fully cure at ambient temperatures or more quickly at elevated temperatures with an easy to handle one to three mixing ratio by weight. The cured compound exhibits a high elongation (greater than 25%); truly exceptional for a thermally conductive epoxy. After mixing EP21TDC-2AN generates a very low exotherm, which allows for a long working life. This epoxy compound exhibits good tensile shear and peel strength for bonding and sealing. It adheres well to a wide variety of substrates including metals, glass, ceramics, rubbers and many plastics. This cured adhesive is an excellent electrical insulator with superior chemical resistance to water, fuels and many solvents. It excels at withstanding thermal shock, thermal cycling and mechanical shock. This compound features a service temperature range of 4K to 250°F and has been successfully employed in a number of cryogenic applications. Master Bond EP21TDC-2AN is a versatile system that offers the structural benefits of an epoxy, yet incorporates flexibility and very impressive thermal conductivity. It is widely used in the electronic, electro-optical and related industries. The color of Part A is light gray; Part B is gray.

Product Advantages

• Convenient mixing: non-critical one to three mix ratio by weight
• Easy application: product spreads evenly and smoothly
• Desirably long working life
• Versatile cure schedules: ambient temperature cures or faster, elevated temperature cures
• High thermal conductivity combined with good electrical insulation properties
• High peel strength and elongation
• Excellent flexibility; exceptional thermal shock and chemical resistance
• Superior bonding properties to similar and dissimilar substrates; superb impact resistance
• Cryogenically serviceable down to 4K