EP30ND

Master Bond EP30ND is a paste consistency, two component epoxy system for high performance bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures. An optimum cure schedule is overnight at room temperature followed by 2-3 hours at 150-200°F. Its mix ratio is a non-critical four to one by weight. It has exceptionally low linear shrinkage upon cure, less than 0.1%. This system is 100% reactive and does not contain any solvents or diluents. EP30ND has a superior profile of physical strength properties. It bonds well to a wide variety of materials including metals, composites, glass, ceramics, rubbers and many plastics. Its adhesion is characterized as being high strength and rigid with exceptional dimensional stability. It is a reliable electrical insulator. EP30ND is quite stable in many harsh chemical environments including water, oils and fuels as well as a number of acids and bases. The service temperature range is -60°F to +300°F. It is opaque black and does not transmit any light. This versatile system can be used in the aerospace, electronic, optical, opto-electronic and specialty OEM applications. EP30ND is recommended primarily when a room temperature curing system with enhanced performance properties is desirable.

Product Advantages

• Paste consistency, easy to apply
• High physical strength properties
• Opaque black color
• Outstanding electrical insulation properties
• Superior chemical and temperature resistance