Supreme 11AOHTLP

Master Bond Supreme 11AOHTLP is a two component epoxy resin system for high performance bonding, sealing and coating. It is user friendly with a convenient one to one mix ratio by weight or volume. It cures at room temperature or more rapidly at elevated temperatures. The optimum cure is overnight at room temperature followed by 3-4 hours at 150-200°F. Upon mixing Parts A and B, the epoxy has a paste like consistency with a relatively long open time of 60-90 minutes at room temperature for a 100 gram mass.

It bonds well to a wide variety of substrates including metals, composites, ceramics, glass and many plastics. Supreme 11AOHTLP is a “toughened” system which enables it to withstand rigorous thermal cycling and makes it well suited for bonding dissimilar substrates. As noted above, this epoxy is an effective thermal conductor, while retaining its stellar electrical insulation properties. Its service temperature range is from -100 to +400°F. The color of Part A is gray and the color of Part B is off-white. Supreme 11AOHTLP is an attractive candidate for electronic, electro-optic, aerospace and related applications where high strength, excellent thermal transfer properties, high temperature resistance and easy handling are desirable.

Product Advantages

• Convenient handling, longer open time
• Toughened system, can withstand thermal cycling
• Thermally conductive and electrically insulative
• High temperature resistance up to +400°F
• Exceptionally good dimensional stability