EP126TK

Two part non-drip epoxy for bonding and sealing featuring very high temperature resistance
Key Features
  • Excellent glass transition temperature, +240°C
  • Noteworthy bonding strength
  • Outstanding chemical resistance
  • Top notch machineablilty
Typical Properties
Viscosity
paste
Cure Schedule
3-4 hours at 300°F or 2-3 hours at 350°F; post curing for 12-24 hours at 400-450°F
Service Temperature Range
-80°F to +600°F
Dielectric Constant
3.9
Glass Transition Temperature (Tg)
160 to 180°C
Image
Two Part Epoxy EP126TK
Certifications

Meets EU Directive 2015/863

Packaging
Product Description

Master Bond EP126TK is a specialty type two part epoxy that excels in high temperature applications up to +600°F. It has an impressive glass transition temperature of around +240°C. EP126TK has slightly different handling properties when compared to other epoxies, but ultimately, is easily processable. With this compound, Part A is a paste and Part B is a powder. To process, Part A is first heated to 150-160°F. Then Part B is added and stirred, based on a forgiving 100 to 50 mix ratio by weight. The mixed system is a malleable paste, with an exceedingly long open time, that can be easily applied to the substrates. The curing is straightforward; 3-4 hours at 300°F or 2-3 hours at 350°F. For optimum properties, post curing for 12-24 hours at 400-450°F is recommended. EP126TK will not flow while curing.

EP126TK bonds well to a wide variety of substrates, including metals, composites, glass, ceramics, rubbers and many plastics. Additionally, it is formulated as a toughened system allowing it to withstand rigorous thermal cycling. The epoxy system offers enhanced tensile lap shear strength, fine dimensional stability, strikingly high compressive strength along with low shrinkage upon curing. EP126TK is a very good electrical insulator, especially as it retains highly insulative properties at elevated temperatures. Furthermore, it has superb chemical resistance to water, oils, acids, bases and many solvents. EP126TK should be considered for the most demanding electronic, aerospace, optical and OEM applications based on this solid performance profile.

Product Advantages

  • Excellent long-term thermal stability
  • Dimensionally stable and machineable
  • 100% reactive—no solvents or other volatiles
  • High adhesion to metallic and non-metallic substrates
  • Robust physical strength profile especially in the compressive mode
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