Master Bond EP41S-5 is a two part epoxy system for bonding, sealing and coating with a forgiving 100 to 25 mix ratio by weight. EP41S-5 will cure at room temperature or more rapidly at elevated temperatures. The optimum curing schedule is overnight at 75°F followed by 3-4 hours at 150-200°F. It has exemplary resistance to a wide array of chemicals, especially acids, bases, alcohols, fuels and solvents. Most noteworthy is its resistance to methylene chloride, phenol (10%), nitric acid (30%) as well as ethanol and acetone.
Encapsulation
Master Bond EP31ND is a two part epoxy system used mostly for bonding, but is also serviceable for sealing and encapsulation. This compound has a forgiving mix ratio of 100 to 30 by weight and contains no solvents or diluents. It cures readily at room temperature or more rapidly at elevated temperatures. At ambient temperatures it cures in about 1-2 days, and at 200°F, the curing time is about 2-3 hours. To optimize properties, an overnight cure at room temperature followed by 2-3 hours at 150-200°F is desirable.
Master Bond EP45HTND-2 is a two component epoxy system with exceptional performance as an adhesive, sealant and coating in hostile environments. It is most noteworthy for its exquisite resistance to elevated temperatures and its ability to withstand many problem type chemicals. EP45HTND-2 is a specialty type system with a 100 to 30 mix ratio by weight. It has a paste viscosity and will not flow while curing, but it is easy to mix at room temperature. It requires oven curing for 3-4 hours at 250°F or 2-3 hours at 300°F.
Master Bond EP21H is a two component epoxy system with exceptionally good clarity and a unique optical transmission profile for an epoxy. Nearly all epoxies display minimal light transmission below 330 nm. EP21H has a special crosslinking profile that allows for exceptional light transmission in the 250-365 nm spectra. The light transmission in sections of 0.005 inch or less exceeds almost 95% from 260-2,000 nm. EP21H is easy to handle having a long open time. EP21H will cure at room temperature and it can be accelerated by adding heat.
Master Bond EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. This system, which is not premixed and frozen, has unlimited working life at room temperature. Unlike typical one part epoxies, EP3RR-80 will cure in 45-50 minutes at 175-180°F, or in 25-30 minutes 250°F. Although optimal properties are obtained with the higher temperature cure, the 175-180°F cure provides very good physical strength and electrical insulation values as well. EP3RR-80 has a moderate viscosity with excellent flow.