Master Bond EP13SPND-2 is a one component, heat curing epoxy with prominent temperature resistance and stellar bonding attributes. This one part system will cure at temperatures of 300-350°F for 60-90 minutes. For optimum properties, a post cure of 2 hours at 350-400°F is highly recommended. It is primarily used as a structural adhesive. EP13SPND-2 is somewhat exothermic and is typically cured in bond line thickness of 2-8 thousandths of an inch. The system has a paste consistency that is easy to apply and will not flow when cured.
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