Cans

Master Bond EP41S-5 is a two part epoxy system for bonding, sealing and coating with a forgiving 100 to 25 mix ratio by weight. EP41S-5 will cure at room temperature or more rapidly at elevated temperatures. The optimum curing schedule is overnight at 75°F followed by 3-4 hours at 150-200°F. It has exemplary resistance to a wide array of chemicals, especially acids, bases, alcohols, fuels and solvents. Most noteworthy is its resistance to methylene chloride, phenol (10%), nitric acid (30%) as well as ethanol and acetone.

Master Bond EP31ND is a two part epoxy system used mostly for bonding, but is also serviceable for sealing and encapsulation. This compound has a forgiving mix ratio of 100 to 30 by weight and contains no solvents or diluents. It cures readily at room temperature or more rapidly at elevated temperatures. At ambient temperatures it cures in about 1-2 days, and at 200°F, the curing time is about 2-3 hours. To optimize properties, an overnight cure at room temperature followed by 2-3 hours at 150-200°F is desirable.

Master Bond EP21HTND is a two component, room temperature curing epoxy adhesive, sealant and coating with a paste viscosity and non-drip application feature. Its most outstanding features are easy handling, exceptional physical strength properties and resistance to higher temperatures. The two parts are easy to mix and the ratio is very forgiving either by weight or volume. It cures readily at room temperature or faster at elevated temperatures with the optimum being overnight at room temperature followed by 1-2 hours at 150-200°F.

Master Bond EP21HTFG is a two component, room temperature curing epoxy adhesive, sealant and coating. Its most outstanding features are easy handling, superb physical strength properties and superior resistance to higher temperatures. The two parts are easy to mix and the ratio is very forgiving either by weight or volume. It cures readily at room temperature or faster at elevated temperatures with the optimum being overnight at room temperature followed by 1-2 hours at 150-200°F.

Master Bond EP21TDCHTND is a two component epoxy adhesive, sealant and coating featuring high performance, versatility and exceptional user friendliness. It has a very forgiving and convenient one to one mix ratio by weight or volume. It cures at ambient temperatures that can be accelerated by adding heat, with the optimum cure schedule being overnight at room temperature, followed by 1-2 hours at 150-200°F. This non-drip viscosity system bonds well and with minimum shrinkage to a wide variety of substrates including metals, composites, glass, ceramics and many plastics and rubbers.

Master Bond EP21AOND is a two component, thermally conductive, electrically insulating epoxy adhesive, sealant, and coating with an excellent performance profile and easy handling. It has a forgiving one to one mix ratio by weight or volume along with a paste consistency. It cures at ambient temperatures or more rapidly at elevated temperatures with the optimum schedule being overnight at room temperature followed by a few hours at 150-200°F. Most importantly, it is an excellent thermal conductor yet maintains superior electrical insulation values.

Master Bond EP45HTND-2 is a two component epoxy system with exceptional performance as an adhesive, sealant and coating in hostile environments. It is most noteworthy for its exquisite resistance to elevated temperatures and its ability to withstand many problem type chemicals. EP45HTND-2 is a specialty type system with a 100 to 30 mix ratio by weight. It has a paste viscosity and will not flow while curing, but it is easy to mix at room temperature. It requires oven curing for 3-4 hours at 250°F or 2-3 hours at 300°F.

Master Bond EP21H is a two component epoxy system with exceptionally good clarity and a unique optical transmission profile for an epoxy. Nearly all epoxies display minimal light transmission below 330 nm. EP21H has a special crosslinking profile that allows for exceptional light transmission in the 250-365 nm spectra. The light transmission in sections of 0.005 inch or less exceeds almost 95% from 260-2,000 nm. EP21H is easy to handle having a long open time. EP21H will cure at room temperature and it can be accelerated by adding heat.

Master Bond EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. This system, which is not premixed and frozen, has unlimited working life at room temperature. Unlike typical one part epoxies, EP3RR-80 will cure in 45-50 minutes at 175-180°F, or in 25-30 minutes 250°F. Although optimal properties are obtained with the higher temperature cure, the 175-180°F cure provides very good physical strength and electrical insulation values as well. EP3RR-80 has a moderate viscosity with excellent flow.

Master Bond Supreme 45HTND-2 is a two component epoxy system featuring an attractive blend of superior physical properties especially shear and peel strengths for high performance structural bonding applications. It has a fine temperature resistance range of -100°F to +450°F. It is 100% reactive and does not contain any solvents or diluents. Supreme 45HTND-2 is primarily formulated to withstand rigorous thermal cycling, especially when bonding dissimilar substrates.