Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP114 Two component, optically clear, nanosilica filled epoxy for potting, encapsulating, coating and sealing Glass Transition Temperature (Tg) 210-215°C Tensile Modulus >1,000,000 psi	1,000 Hours at 85°C/85% RH ASTM D4060-14 for Abrasion Resistance NASA Low Outgassing RoHS Compliant	Bonding Coating Encapsulation Gap Filling Potting Sealing Underfill	500-1,500 cps	2-3 hours at 250°F followed by 5-8 hours at 300°F with a 2 hour or longer post cure at 350°F	85-95 Shore D	-100°F to +550°F	/es/tds/ep114
EP15 One part epoxy for testing adhesion or cohesive strength of ceramic based flame-sprayed coatings Tensile Strength 12,000-14,000 psi Tensile Lap Shear Strength 2,600-2,800 psi	1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding	40,000-65,000 cps	300-350°F for 60-90 minutes, with an optimum cure schedule of 60-90 minutes at 300-350°F plus post cure 4-6 hours at 300-350°F	80-90 Shore D	-60°F to +250°F	/es/tds/ep15
EP17HT-LO One component epoxy system for bonding, sealing, coating and casting Glass Transition Temperature (Tg) 200-210°C Tensile Lap Shear Strength 3,000-3,200 psi at 75°F	1,000 Hours at 85°C/85% RH NASA Low Outgassing RoHS Compliant	Bonding Coating Encapsulation Gap Filling Sealing	45,000-75,000 cps	300°F for 4-6 hours, plus 12-24 hours at 350°F	80-90 Shore D	-80°F to +600°F	/es/tds/ep17ht-lo
EP21LVMed Low viscosity, two component epoxy compound Dielectric Strength 440 volts/mil Tensile Lap Shear Strength >2,800 psi	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Casting Coating Encapsulation Potting Sealing	Part A: 10,000-14,000 cps, Part B: 11,000-15,000 cps	overnight at 75°F followed by 1-2 hours at 150-200°F	>70 Shore D	-65°F to +250°F	/es/tds/ep21lvmed
EP21TCHT-1 Two component epoxy compound for high performance bonding and sealing Coefficient of Thermal Expansion 18-21 X 10⁻⁶ in/in/°C Glass Transition Temperature (Tg) 135-140°C	1,000 Hours at 85°C/85% RH IEC 61249-2-21 for Halogen Free MIL-STD-810G for Fungus Resistance NASA Low Outgassing RoHS Compliant	Bonding Coating Encapsulation Gap Filling Sealing	paste	overnight at 75°F followed by 2 hours at 175-200°F	85-95 Shore D	4K to +400°F	/es/tds/ep21tcht-1
EP29LPSP Two component epoxy compound for cryogenic applications Dielectric Constant 3.95 Refractive Index 1.56	NASA Low Outgassing RoHS Compliant	Bonding Casting Coating Encapsulation Gap Filling Impregnation Potting Sealing Underfill	Part A: 10,000-16,000 cps, Part B: 10 - 70 cps	Gel at room temp followed by any option listed below: 8-10 hours at 130-150°F or 5-7 hours at 175°F or 3-5 hours at 200°F	>65 Shore D	4K to +275°F	/es/tds/ep29lpsp
EP30-2 Two component, room temperature curing epoxy system for bonding, sealing, coating and encapsulation featuring a wide range of desirable properties Dielectric Constant 3.5 Refractive Index 1.55	1,000 Hours at 85°C/85% RH NASA Low Outgassing RoHS Compliant	Bonding Coating Encapsulation Gap Filling Sealing	Part A: 10,000-16,000 cps, Part B: 10-35 cps	24-48 hours at 75°F; 2-3 hours at 200°F	80-90 Shore D	4K to +300°F	/es/tds/ep30-2
EP3HT-LO One part, heat curing, no mix epoxy system Tensile Lap Shear Strength 1,600-1,800 psi Volume Resistivity >10¹⁴ ohm-cm	1,000 Hours at 85°C/85% RH NASA Low Outgassing RoHS Compliant	Bonding Coating Gap Filling Sealing	100,000-200,000 cps	250°F for 20-30 minutes or 300°F for 5-10 minutes, followed by 1 to 3 hours at 250 to 300°F	80-90 Shore D	-60°F to +400°F	/es/tds/ep3ht-lo
EP3HTS-TC One component, silver filled epoxy featuring extraordinary electrical and thermal conductivity Thermal Conductivity 110-118 BTU•in/(ft²•hr•°F) [16-17 W/(m•K)] Volume Resistivity <1x10⁻³ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Coating Die Attach Sealing	paste	Cures rapidly at 250 to 300°F	60-70 Shore D	-80°F to +400°F	/es/tds/ep3hts-tc
EP3HTSDA-2 One component epoxy system featuring excellent electrical and thermal conductivity Thermal Conductivity 45-49 BTU•in/(ft²•hr•°F) [6.5-7 W/(m•K)] Volume Resistivity <0.001 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Coating Die Attach Gap Filling Sealing	>400,000 cps	250°F for 20-30 minutes, 300°F for 5-10 minutes, optimum cure schedule is either option above, plus 1 hour at 250-300°F	75-85 Shore D	-80°F to +450°F	/es/tds/ep3htsda-2

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